Table of contents
Silicon Hybrids in Action
R.W. Harcourt, O. Zorba, A.G. WhitakerThe custom hybrid manufacturer must be able to offer the optimal multi‐chip module (MCM) solution from a portfolio of technologies. At present no single interconnect technology…
Crystal Oscillator with Temperature Compensation Realised in Thick Film Technology
M. Pavšek, D. Belavič, U. Kunaver, M. HrovatThe design of temperature‐compensated quartz crystal oscillators (TCXOs) in thick film hybrid technology is described. TCXOs controlled by varicap diodes are usually realised with…
Multichip Module Technology: The Transition from Research to Manufacture
D.J. PedderThe benefits of the thin film multichip module (MCM‐D) approach to high density packaging for VLSI devices have now been amply demonstrated by a number of research groups. The…
Copper Thick‐film Firing Optimisation Using a New Nitrogen‐based Atmosphere Control System
S. Mellul, P. DupinA new proprietary nitrogen‐based atmosphere control system (Alix 1) has been developed by L'Air Liquide, allowing control and regulation of the oxygen partial pressure in the…
Hybrid (and Multi‐chip Module) Design on the IBM‐PC Platform
T. CorlessThe increased power and the memory available on IBM‐PC and compatible computers have led to the emergence of a wide range of engineering software. The large number of PCs offers…
Development of a Cost‐effective and Flexible Bumping Method for Flip‐chip Interconnections
J. LiuMany bumping techniques for flip‐chip interconnections have been developed based on sputtering and electrolytic plating processes. In order to allow bumping on single chips, a new…
The Material Science of a Non‐warp, Hermetic, Non‐battery Effect, Crystallising Dielectric for Simplification of Multilayer Hybrid Circuitry Construction
B. Sjoeling, S. TurveyTo meet the hybrid industry's growing need for low‐cost, high‐reliability, high‐density multilayer circuitry, the authors' company has developed a non‐warp, hermetic, non‐battery…
Solderability Testing in Hybrid Technology
R.A.L. Vanden Berghe, B. WillemsThe solderability of a material is considered as the ability of the surface to be wetted by solder, and the rate at which this process occurs. The solderability of thick film…
ISHM news
Robert Blancquaert, Miloš Somora, M.S. Vijayaraghavan, D.J. LowrieISHM‐Benelux has recently set up a permanent secretariat at the following address:
Industry news
EMCA‐REMEX Products Ablestik Laboratories European Operations, Linton, Cambridge, have been awarded ISO 9002 accreditation for their quality system. The award represents 18 months…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson