Online from: 1982
Subject Area: Electrical & Electronic Engineering
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|Title:||Recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging|
|Author(s):||Z.W. Zhong, (School of MAE, Nanyang Technological University, Republic of Singapore), T.Y. Tee, (Amkor Technology Singapore, Republic of Singapore), J-E. Luan, (STMicroelectronics, Republic of Singapore)|
|Citation:||Z.W. Zhong, T.Y. Tee, J-E. Luan, (2007) "Recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging", Microelectronics International, Vol. 24 Iss: 3, pp.18 - 26|
|Keywords:||Joining process, Soldering, Wires|
|Article type:||General review|
|DOI:||10.1108/13565360710779154 (Permanent URL)|
|Publisher:||Emerald Group Publishing Limited|
Purpose – This paper seeks to review recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging.
Design/methodology/approach – Of the 91 journal papers, 59 were published in 2005-2007 and topics related to wire bonding, flip chip and lead-free solder for advanced microelectronics packaging are reviewed.
Findings – Research on advanced wire bonding is continuously performed for advanced and complex applications such as stacked-dies wire bonding, wire bonding of low-
Research limitations/implications – Because of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.
Originality/value – This review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.
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