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Journal cover: Rapid Prototyping Journal

Rapid Prototyping Journal

ISSN: 1355-2546

Online from: 1995

Subject Area: Mechanical & Materials Engineering

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Profile invalidation approaching rapid prototyping

Document Information:
Title:Profile invalidation approaching rapid prototyping
Author(s):Yang Tong, (School of Material Science and Engineering, Dalian University of Technology, Dalian, China), Yao Shan, (School of Material Science and Engineering, Dalian University of Technology, Dalian, China), Zeng Feng, (Department of Computer Science and Technology, Jia Ying University, Meizhou, China)
Citation:Yang Tong, Yao Shan, Zeng Feng, (2010) "Profile invalidation approaching rapid prototyping", Rapid Prototyping Journal, Vol. 16 Iss: 2, pp.146 - 155
Keywords:Computer aided manufacturing, Process management, Rapid prototypes
Article type:Research paper
DOI:10.1108/13552541011025870 (Permanent URL)
Publisher:Emerald Group Publishing Limited

Purpose – The purpose of this paper is to present a novel rapid prototyping (RP) approach and verifying its feasibility. This alternative solution is to bring several merits from both selective laser sintering and laminated object manufacturing.

Design/methodology/approach – The phenolic resin coated sand is used in this method. It could be cured at an appropriate temperature and be invalidated at a higher one. Therefore, the fabrication flows from laser cutting along slice profiles to a bulk curing heating after stacking up. Finally, the workpiece may be detached out of the excess material. Experiments and modeling on laser scanning are conducted to optimize the processing parameters, which, along with the direct slicing strategy, guarantee the part performance.

Findings – A novel prototyping system is developed comprising the software package and prototyping machine, through which several specimens are fabricated. The results show the feasibility of the proposed RP method.

Originality/value – This research brings the applicability of a hybrid solution: profile invalidation RP.

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