Online from: 1974
Subject Area: Electrical & Electronic Engineering
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|Title:||New lifecycle monitoring system for electronic manufacturing with embedded wireless components|
|Author(s):||Axel Bindel, (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK), Paul Conway, (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK), Laura Justham, (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK), Andrew West, (Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK)|
|Citation:||Axel Bindel, Paul Conway, Laura Justham, Andrew West, (2010) "New lifecycle monitoring system for electronic manufacturing with embedded wireless components", Circuit World, Vol. 36 Iss: 2, pp.33 - 39|
|Keywords:||Design for assembly, Electronic equipment and components, Manufacturing systems, Printed circuits, Tracer methods|
|Article type:||Research paper|
|DOI:||10.1108/03056121011041681 (Permanent URL)|
|Publisher:||Emerald Group Publishing Limited|
|Acknowledgements:||The authors wish to express their gratitude to the project partners (i.e. Invotec Ltd, STI Ltd, GE Aviation, Ford UK, C-Tech Innovation Ltd, RIB Technologies and SIMS Ltd) for their collaboration. This paper is supported by the Technology Strategy Board (TSB) and the Engineering and Physical Sciences Research Council (EPSRC) under the INBOARD (award TP11/HVM/6/I/AB138G) and EMBLEM research proposals.|
Purpose – The purpose of this paper is to present an update of and the latest results from work on a project aimed at monitoring electronic products during the whole life cycle with embedded wireless components.
Design/methodology/approach – Business processes of the electronic manufacturing supply chain were analysed. A business case and the system opportunities for life cycle monitoring, based on embedded wireless components system were developed. Radio frequency identification (RFID) assembly technology was adapted for the integration of components into a multi-layer printed circuit board (PCB).
Findings – By storing product-related information into electronic products, tracing of components, monitoring of processes, operations and costs, environmentally optimised recycling can be enhanced.
Research limitations/implications – The research undertaken so far relates to the embedding of RFID tags into PCBs. Wireless components with more processing power will be used in the next project phase.
Originality/value – The paper details how wireless components can be embedded into multi-layer PCBs and how a business case for a life cycle monitoring system can be established.
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