Online from: 1974
Subject Area: Electrical & Electronic Engineering
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|Title:||Development of an ultra-small micro drill bit for packaging substrates|
|Author(s):||Lianyu Fu, (Shenzhen Jinzhou Precision Technology Corporation, Shenzhen, People's Republic of China), Qiang Guo, (Shenzhen Jinzhou Precision Technology Corporation, Shenzhen, People's Republic of China)|
|Citation:||Lianyu Fu, Qiang Guo, (2010) "Development of an ultra-small micro drill bit for packaging substrates", Circuit World, Vol. 36 Iss: 3, pp.23 - 27|
|Keywords:||Drilling rigs, Packaging, Printed circuit boards|
|Article type:||Technical paper|
|DOI:||10.1108/03056121011066305 (Permanent URL)|
|Publisher:||Emerald Group Publishing Limited|
Purpose – The paper aims to present key points regarding the development of an ultra-small micro drill bit for packaging substrate hole processing.
Design/methodology/approach – Key points for the development of ultra-small drill bits are presented. These are based on a study of the influential mechanisms of micro drill bit material properties, key parameters and coating techniques on the behaviours of micro drill bit. Experiments were conducted to verify the drilling capability of the developed ultra-small micro drill bits.
Findings – The material properties of micro drill bits are of great importance in ensuring the performance. Helix angle, primary face angle and point angle are three key parameters that significantly influence drill bit behaviour. Computer-aided engineering analysis, temperature monitoring and video monitoring techniques in high-speed drilling are useful tools for achieving the optimal design of ultra-small drill bits. Using coating technology on ultra-small drill bits can improve their hit limits by nearly four times.
Originality/value – The paper highlights key points to consider when developing ultra-small micro drill bits. The presented points can provide an overall understanding of the challenges and solutions during ultra-small micro drill bit design. Additionally, this paper presents a solution for packaging substrate ultra-small hole processing by mechanical drilling.
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