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Journal cover: Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

Subject Area: Electrical & Electronic Engineering

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Effect of solder joint integrity on the thermal performance of a TEC for a 980?nm pump laser module


Document Information:
Title:Effect of solder joint integrity on the thermal performance of a TEC for a 980?nm pump laser module
Author(s):G. Takyi, (Department of Mechanical Engineering, Kwame Nkrumah University of Science and Technology, Kumasi, Ghana), E.H. Amalu, (Electronics Manufacturing Engineering Research Group, Medway School of Engineering, University of Greenwich, Chatham Maritime, UK), P.K. Bernasko, (Electronics Manufacturing Engineering Research Group, Medway School of Engineering, University of Greenwich, Chatham Maritime, UK)
Citation:G. Takyi, E.H. Amalu, P.K. Bernasko, (2011) "Effect of solder joint integrity on the thermal performance of a TEC for a 980?nm pump laser module", Soldering & Surface Mount Technology, Vol. 23 Iss: 2, pp.115 - 119
Keywords:Acoustic testing, Coolers, Lasers, Microscopy, Solder, Thermoelectricity
Article type:Research paper
DOI:10.1108/09540911111120186 (Permanent URL)
Publisher:Emerald Group Publishing Limited
Acknowledgements:The authors would like to acknowledge the support of the Director of Operations, JDS Uniphase for access to equipment and raw materials. Special thanks go to the operators who contributed to the assembly of the piece parts and soldering trials.
Abstract:

Purpose – The purpose of this paper is to evaluate the effect of solder wettability on the thermal performance of a thermo-electric cooler (TEC) of a 980?nm pump laser module.

Design/methodology/approach – In this paper, TEC thermal performance has been evaluated using a heat pump test. The results were compared with scanning acoustic microscopy (C-SAM) results in order to have a better understanding of the thermal behaviour of the TEC. In the C-SAM experiments, images were taken at the interfaces between the housing and TEC, as well as at the interfaces between the chip-on-carrier (CoC) and TEC.

Findings – The heat pump test results indicate a strong correlation with the C-SAM test results. The C-SAM observations show good solder joint at the interface between the TEC and housing in the case of the device that yielded a good heat pump test result (11.5°C) and poor solder joints (gross de-lamination) at the interface between the TEC and housing in the case of the device that yielded a poor heat pump test result (24.4°C). The C-SAM observations did not show much difference at the interface between the CoC and TEC. The results from this study were used to qualify the post-vacuum soldered laser pump devices at JDS Uniphase, Plymouth, UK.

Originality/value – The findings presented in this paper indicate that the level of solder wettability at the interfaces between the piece parts impacts the thermal performance of the TEC.



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