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Journal cover: Microelectronics International

Microelectronics International

ISSN: 1356-5362

Online from: 1982

Subject Area: Electrical & Electronic Engineering

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Characterization of low- benzocyclobutene dielectric thin film


Document Information:
Title:Characterization of low- benzocyclobutene dielectric thin film
Author(s):K.C. Chan, (MicroFab Technology Pte Ltd, Singapore), M. Teo, (School of Material Engineering, Nanyang Technological University, Singapore), Z.W. Zhong, (School of Mechanical and Production Engineering, Nanyang Technological University, Singapore)
Citation:K.C. Chan, M. Teo, Z.W. Zhong, (2003) "Characterization of low- benzocyclobutene dielectric thin film", Microelectronics International, Vol. 20 Iss: 3, pp.11 - 22
Keywords:Curing, Shrinkage, Thin film
Article type:Research Paper
DOI:10.1108/13565360310487909 (Permanent URL)
Publisher:MCB UP Ltd
Abstract:This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin-on polymer for use as interlayer dielectric in the microelectronics industry. Research work is divided into three main sections. First, BCB thin film characterization was done to investigate the effects of curing conditions on BCB film thickness, dielectric properties, optical properties and extent of cure. Thermal stability of BCB was then evaluated using thermogravimetric analysis (TGA) to detect weight loss during thermal curing and degradation. Finally, curing kinetics study was conducted using both differential scanning calorimetry (DSC) dynamic (American Society for Testing and Materials method) and isothermal approaches. The first study shows that determination of vitrification point during thermal curing of BCB is crucial to predict film properties. By curing to just before vitrification, lowest refractive index, hence dielectric constant, could be obtained.



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