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Journal cover: Circuit World

Circuit World

ISSN: 0305-6120

Online from: 1974

Subject Area: Electrical & Electronic Engineering

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Table of contents:
Volume 31 issue 1

Published: 2004, Start page: p8

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Articles
Article Id: Article Information:
878365 Characterization of PCB plated-through-hole reliability using statistical analysis
Mark J. Tardibuono (pp. 8 - 15)
Keywords: Printed-circuit boards, Product reliability, Statistical analysis
Article type: Conceptual paper
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878366 Commercial applications of digital printing technologies on PCBs
Hans Fritz (pp. 16 - 20)
Keywords: Ink-jet printers, Optimization techniques, Printed-circuit boards
Article type: Technical paper
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878367 Design considerations for thin-film embedded resistor and capacitor technologies
Percy Chinoy, Marc Langlois, Raj Hariharan, Mike Nelson, Anthony Cox, Tony Ridler (pp. 21 - 27)
Keywords: Capacitors, Design for assembly, Electrical components, Thin films
Article type: Conceptual paper
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1455580 Immersion tin: a proven final finish for printed circuit boards providing reliable solderability and marginal formation of tin-whiskers
Peter Meeh (pp. 28 - 40)
Keywords: Printed-circuit boards, Process management, Surface treatment
Article type: Conceptual paper
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878368 The origins and evolution of the PCB: a review
Kirstie Petherbridge, Peter Evans, David Harrison (pp. 41 - 45)
Keywords: History, Printed-circuit boards
Article type: Conceptual paper
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Obituary

Article Id: Article Information:
1487838 William MacLeod Ross: an Obituary
John Walker
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New products

1487832 New 2D/3D X-ray inspection system with digital imaging capability
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1487833 Package puts PCB designs to the thermal test
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1487834 New PCB controlled impedance test system Polar CITS800s
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1487835 Enthone introduces STANNOSTAR® 1405
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Literati Club

1487813 Awards for Excellence
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Interview

1487837 Circatex – new business, new strategy, new logo, but the name stays the same!
Pete Starkey
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Internet commentary

1487839 Internet commentary
Brian Ellis
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International diary

1487831 International diary
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Intellect column

1487836 Collaborative Ventures
Frank Coultard
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Industry news

1487819 Shenzhen Huamei Electroplating Technology Limited voted &ldquo
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1487820 Westwind office move
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1487821 Nelco SAS is becoming part of Park's Neltec Group
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1487822 Good news for PAL Europe
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1487823 March Plasma Systems opens offices in Japan
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1487824 New illumination attracts Calumet
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1487825 Anglia Circuits Open day
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1487826 AT&S advances by leaps and bounds
John Ling
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Exhibitions and conferences

1487827 NEPCON 2004, Brighton, Sussex, England, 26-27 May
John Ling
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1487828 EIPC Summer Conference 2004, Basel, Switzerland, 24 and 25 June
John Ling
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1487829 2004 International Conference on WEEE and RoHS, Guangzhou, China, 10 and 11 June
Martin Goosey
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1487830 Embedded passives conference at National Physical Laboratory
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Editorial

1487811 Editorial
Martin Goosey
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Call for papers

1487812 6th International Conference on Electronics Materials and Packaging (EMAP 2004)
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Association news

1487814 ICT Annual Symposium 2004
Pete Starkey
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1487815 David Kennedy Memorial Awards for 2003
Pete Starkey
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1487816 UK electronic design and innovation gets a voice
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1487817 Successful 2004 IPC exhibition carries over to 2005 show
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1487818 IPC keynote speaker makes history
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