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Home > Circuit World > Table of contents:Volume 33 issue 2
Circuit World
ISSN: 0305-6120
Online from: 1974
Subject Area: Electrical & Electronic Engineering
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Table of contents:
Volume 33 issue 2
Published: 2007, Start page: p4Special Issue: Influence of Environmental Issues on Materials Choices in PCB Fabrication
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| 1603486 | Regulations and market trends in lead-free and halogen-free electronics Lei Nie, Michael Pecht, Richard Ciocci (pp. 4 - 9) Keywords: Electronics industry, Environmental management, Environmental regulations, Halogens, Lead, Printed circuits Article type: Conceptual paper Please login | Abstract & purchase [ HTML & PDF (77kb) ] | Reprints & permissions |
| 1603487 | Printed circuit boards for lead-free soldering: materials and failure mechanisms Per Johander, Per-Erik Tegehall, Abelrahim Ahmed Osman, Göran Wetter, Dag Andersson (pp. 10 - 16) Keywords: Halogens, Lead, Moisture, Printed circuits, Soldering Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (222kb) ] | Reprints & permissions |
| 1603488 | New epoxy resins for printed wiring board applications Bernd Hoevel, Ludovic Valette, Joseph Gan (pp. 17 - 27) Keywords: Electrical properties of materials, Flame retardants, Hazardous materials, Humidity, Laminates, Thermal expansion Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (265kb) ] | Reprints & permissions |
| 1603489 | Lead/halogen-free laminates and their effect on desmearing and metallisation Neil Patton (pp. 28 - 35) Keywords: Halogens, Hazardous materials, Laminates, Metallizing Article type: Technical paper Please login | Abstract & purchase [ HTML & PDF (331kb) ] | Reprints & permissions |
| 1603490 | Selection and qualification of polymers for rigid and flexible interconnect applications Florian Schuessler, Klaus Feldmann, Thomas Bigl (pp. 36 - 42) Keywords: Component manufacturing, Electronics industry, Metallizing, Printed circuits, Soldering, Thermoplastic polymers Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (258kb) ] | Reprints & permissions |
| 1603491 | The advantages of mildly alkaline immersion silver as a final finish for solderability Jing Li Fang, Daniel K. Chan (pp. 43 - 51) Keywords: Acidity, Alkalinity, Silver, Soldering Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (329kb) ] | Reprints & permissions |
| 1603492 | An integrated approach to electronic waste (WEEE) recycling I. Dalrymple, N. Wright, R. Kellner, N. Bains, K. Geraghty, M. Goosey, L. Lightfoot (pp. 52 - 58) Keywords: Electrical equipment, Electronic equipment and components, Recycling, Waste recovery Article type: General review Please login | Abstract & purchase [ HTML & PDF (88kb) ] | Reprints & permissions |
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