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Journal cover: Circuit World

Circuit World

ISSN: 0305-6120

Online from: 1974

Subject Area: Electrical & Electronic Engineering

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Table of contents:
Volume 35 issue 1

Published: 2009, Start page: p3

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Articles
Article Id: Article Information:
1770730 Evaluation of pure tin plated copper alloy substrates for tin whiskers
Sony Mathew, Michael Osterman, Michael Pecht, Frank Dunlevey (pp. 3 - 8)
Keywords: Alloys, Compressive strength, Copper, Crystallization, Substrates
Article type: Research paper
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1770731 Intrinsically conductive polymer for PWB direct metallization: process reliability by process management
Jean Rasmussen (pp. 9 - 15)
Keywords: Metallizing, Polymers, Printed circuits, Process management
Article type: Research paper
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1770732 A compact ultra-wideband bandpass filter with ultra-fine conductor trace based on liquid crystal polymer substrates
Xia Zhang, Johan Liu, Camilla Kärnfelt, Shiwei Ma, Xu Wang, Linqin Meng, Herbert Zirath (pp. 16 - 21)
Keywords: Electronic equipment and components, Liquid crystal polymers, Plasma physics, Substrates
Article type: Research paper
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1770733 Design and performance of metal conductors for stretchable electronic circuits
Mario Gonzalez, Fabrice Axisa, Frederick Bossuyt, Yung-Yu Hsu, Bart Vandevelde, Jan Vanfleteren (pp. 22 - 29)
Keywords: Circuits and circuit theory, Elasticity, Electrical conductivity, Finite element analysis, Polyurethane
Article type: Research paper
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1770734 Replacement of vias with polymer thick film pastes (PTF) for use on flexible substrates
Markus Detert, Michael Zeise, Klaus-Jürgen Wolter (pp. 30 - 33)
Keywords: Polymers pastes, Printed circuits, Soldering, Substrates, Thermoplastic polymers
Article type: Research paper
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1770735 Low cost miniaturization of an implantable prototype
Henna Heinilä, Jarno Riistama, Pekka Heino, Jukka Lekkala (pp. 34 - 40)
Keywords: Appliances and medicines, Electrocardiography, Medical equipment, Printed circuits, Sensors
Article type: Research paper
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International diary

Article Id: Article Information:
1770747 International diary
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Industry news

1770736 Enterprise minister opens new high tech facility at Teknek
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1770737 IPC voices concerns over RoHS revision developments
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1770738 PCB Global Top 20 in 2007
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1770739 IPC midwest proves quality is key to success
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1770740 EU governments looking to increase RoHS enforcement
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1770741 IPC efforts to increase E/CIT funding pay off for US PCB industry
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1770742 Arlon and CCI Eurolam reinforce their coverage of European and Mediterranean markets for ESD products
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1770743 Aspocomp decreased its shareholding in Aspocomp (Thailand) to about 6 percent
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1770744 Eltek Ltd demonstrate the use of complex HDI boards
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1770745 Invotec install laser drilling
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Exhibitions and conferences

1770748 ESTC, 2008 – 2nd Electronics System Integration Technology Conference, 1-4 September 2008, The University of Greenwich, London
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Appointments

1770746 Albert Sadoine appointed general manager of HMS Shanghai
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