ISSN: 0305-6120
Online from: 1974
Subject Area: Electrical & Electronic Engineering
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| Article Id: | Article Information: |
|---|---|
| 1923809 | A solution of aluminum substrate drilling Fumin Song, Lianyu Fu, Fei Zhang (pp. 3 - 7) Keywords: Metals, Physical properties of materials, Substrates Article type: Technical paper Please login | Abstract & purchase [ HTML & PDF (378kb) ] | Reprints & permissions |
| 1923810 | Micro-via approaches for reducing solder voiding Ping Liu, Xiaolong Gu, Xinbing Zhao, Xiaogang Liu (pp. 8 - 11) Keywords: Electronic engineering, Microvias, Soldering Article type: Technical paper Please login | Abstract & purchase [ HTML & PDF (224kb) ] | Reprints & permissions |
| 1923811 | The evolution of organic solderability preservatives (OSP) from a temporary protectant to a leadership position in surface finishing chemistry Michael Carano (pp. 12 - 19) Keywords: Copper, Soldering, Surface chemistry, Surface treatment Article type: Technical paper Please login | Abstract & purchase [ HTML & PDF (235kb) ] | Reprints & permissions |
| 1923812 | Coating thickness measurement of thin gold and palladium coatings on printed circuit boards using X-ray fluorescence Simone Dill, Volker Rößiger (pp. 20 - 26) Keywords: Coatings, Printed circuits, X-ray analysis Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (249kb) ] | Reprints & permissions |
| 1923813 | Testing and long-term monitoring within printed circuit board cleaning technology Štefan Svetský (pp. 27 - 32) Keywords: Cleaning, Contamination, Manufacturing industry, Printed circuits Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (227kb) ] | Reprints & permissions |