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Journal cover: Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

Subject Area: Electrical & Electronic Engineering

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Table of contents:
Volume 26 issue 2 - Latest Issue

Published: 2014, Start page: p53

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Articles
Article Id: Article Information:
17107911 Temperature cycling with Peltier elements of boards with SMD components and failure evaluation
Josef Šandera, Michal Nicák (pp. 53 - 61)
Keywords: Assembly, Fatigue, SMD, Thermal fatigue
Article type: Research paper
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17107912 Reliability analysis of an ACA attached flex-on-board assembly for industrial application
Janne Kiilunen, Laura Frisk (pp. 62 - 70)
Keywords: Anisotropic conductive adhesive, Flexible PCBs, Reliability, Shear strength
Article type: Research paper
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17107913 Statistical analysis of stencil technology for wafer-level bumping
Robert W. Kay, Gerard Cummins, Thomas Krebs, Richard Lathrop, Eitan Abraham, Marc Desmulliez (pp. 71 - 78)
Keywords: Interconnects, Pb-free, Solder joints, Stencil printing, Wafer-level package
Article type: Research paper
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17107914 Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution
Liu Mei Lee, Muhammad Firdaus Mohd Nazeri, Habsah Haliman, Ahmad Azmin Mohamad (pp. 79 - 86)
Keywords: Intermetallic compounds, Microstructure, Oxidation, Reflow soldering, Sn-Ag-Cu
Article type: Research paper
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17107915 Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow
J. Mittal, K.L. Lin (pp. 87 - 95)
Keywords: Intermetallic compounds, Reflow soldering, Solder alloys, Solder joints
Article type: Research paper
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