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Journal cover: Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

Subject Area: Electrical & Electronic Engineering

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Table of contents:
Volume 26 issue 3 - Latest Issue

Published: 2014, Start page: p97

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Articles
Article Id: Article Information:
17114158 Influence of PTH offset angle in wave soldering with thermal-coupling method
Mohd Sharizal Abdul Aziz, Mohd Zulkifly Abdullah, Chu Yee Khor (pp. 97 - 109)
Keywords: Capillary flow, Pin-through-hole (PTH), Thermal fluid structure interaction (FSI), Wave soldering
Article type: Research paper
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17114159 A method for the tin pest presence testing in SnCu solder alloys
Agata Skwarek, Jan Kulawik, Andrzej Czerwinski, Mariusz Pluska, Krzysztof Witek (pp. 110 - 116)
Keywords: Diagnostic test, Inoculation, Solder joint reliability, Tin alloys, Tin pest
Article type: Research paper
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17114160 Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications
Jussi Putaala, Olli Salmela, Olli Nousiainen, Tero Kangasvieri, Jouko Vähäkangas, Antti Uusimäki, Jyrki Lappalainen (pp. 117 - 128)
Keywords: Engelmaier’s model, High frequency, Lead-free solders, Low temperature co-fired ceramics (LTCC), Reliability, Thermal fatigue
Article type: Research paper
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17114161 Solder joint imagery compressing and recovery based on compressive sensing
Huihuang Zhao, Yaonan Wang, Zhijun Qiao, Bin Fu (pp. 129 - 138)
Keywords: Assembly, Pin-in-paste, Solder, Solder joints
Article type: Research paper
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17114162 Tin oxide coverage on tin whisker surfaces, measurements and implications for electronic circuits
Barrie D. Dunn, Grazyna Mozdzen (pp. 139 - 146)
Keywords: Electronic components, Lead-free, Oxides, Pure tin, RoHS, Tin oxide, Tin whiskers
Article type: Research paper
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17114163 Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys
Ervina Efzan Mhd Noor, Amares Singh (pp. 147 - 161)
Keywords: Interconnections, Pb-free, Sn-Ag-Cu, Solder, Solder joints
Article type: Literature review
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17114164 Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement
Weisheng Xia, Ming Xiao, Yihao Chen, Fengshun Wu, Zhe Liu, Hongzhi Fu (pp. 162 - 171)
Keywords: Finite element method, Plastic ball grid array, Printed circuit board, Reflow process, Thermal warpage
Article type: Research paper
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Erratum

Article Id: Article Information:
1937994 Erratum
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