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Home > Soldering & Surface Mount Technology > Table of contents:Volume 19 issue 4
Soldering & Surface Mount Technology
ISSN: 0954-0911
Online from: 1989
Subject Area: Electrical & Electronic Engineering
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Table of contents:
Volume 19 issue 4
Published: 2007, Start page: p3Icon key: 
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You have access to this item Backfiles Earlycite Abstract only | Article Id: | Article Information: |
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| 1640771 | Assembly issues with Sn/Ag/Cu bumped flip chips Sunil Gopakumar, Peter Borgesen, K. Srihari (pp. 3 - 10) Keywords: Assembly, Flipchips, Soldering, Yield Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (376kb) ] | Reprints & permissions |
| 1640808 | Hydrocarbon fluxes for ionic compound free soldering Toshihiro Miyake, Masaru Ishida, Satoshi Inagaki (pp. 11 - 17) Keywords: Fluxes, Soldering Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (243kb) ] | Reprints & permissions |
| 1640773 | Characterization of SnAgCu and SnPb solder joints on low-temperature co-fired ceramic substrate Z.W. Zhong, P. Arulvanan, Hla Phone Maw, C.W.A. Lu (pp. 18 - 24) Keywords: Joining materials, Solders, Substrates Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (228kb) ] | Reprints & permissions |
| 1640774 | Low cycle isothermal fatigue properties of lead-free solders Miloš Dušek, Christopher Hunt (pp. 25 - 32) Keywords: Fatigue, Solders Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (430kb) ] | Reprints & permissions |
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