Search
  Advanced Search
 
Journal search
Journal cover: Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

Subject Area: Electrical & Electronic Engineering

Content: Latest Issue | icon: RSS Latest Issue RSS | Previous Issues

Options: To add Favourites and Table of Contents Alerts please take a Emerald profile

Icon: .Table of Contents.Next article.Icon: .

Effect of strain on whisker growth in matte tin


Document Information:
Title:Effect of strain on whisker growth in matte tin
Author(s):A.R. Southworth, (Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan, USA), C.E. Ho, (Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan, USA), A. Lee, (Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan, USA), K.N. Subramanian, (Department of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan, USA)
Citation:A.R. Southworth, C.E. Ho, A. Lee, K.N. Subramanian, (2008) "Effect of strain on whisker growth in matte tin", Soldering & Surface Mount Technology, Vol. 20 Iss: 1, pp.4 - 7
Keywords:Coatings, Electronic engineering, Strain measurement
Article type:Research paper
DOI:10.1108/09540910810861422 (Permanent URL)
Publisher:Emerald Group Publishing Limited
Abstract:

Purpose – To evaluate the role of imposed strain on whisker growth in matte tin, and to identify the appropriate deformation states and environments that will facilitate the development of a reliable, accelerated test methodology to provide results representative of whisker growth under long-term service conditions.

Design/methodology/approach – Whisker growth in matte tin coated strips and wires of copper subjected to various outer fibre strains was characterized at three different temperatures under different humidity conditions.

Findings – This study presents findings of the influence of imposed strain and temperature on whisker growth in a matte tin layers present on a copper substrate. A decrease in incubation time and accelerated growth of whiskers occur with critical imposed strain and specific environmental temperature.

Originality/value – Whisker growth in tin coatings is becoming a major reliability concern in modern microelectronics. Immersion coating that produces a matte tin layer is being used extensively in electronic applications. The findings of this study facilitate the development of accelerated tests which represent events that occur over long periods of time during service so that suitable mitigation strategies can be evaluated in a reasonable time period.



Fulltext Options:

Login

Login

Existing customers: login
to access this document

Login


- Forgot password?
- Athens/Institutional login

Purchase

Purchase

Downloadable; Printable; Owned
HTML, PDF (521kb)Purchase

To purchase this item please login or register.

Login


- Forgot password?

Recommend to your librarian

Complete and print this form to request this document from your librarian


Marked list


Bookmark & share

Reprints & permissions