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Journal cover: Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

Subject Area: Electrical & Electronic Engineering

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Table of contents:
Volume 20 issue 1

Published: 2008, Start page: p4

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Articles
Article Id: Article Information:
1711322 Effect of strain on whisker growth in matte tin
A.R. Southworth, C.E. Ho, A. Lee, K.N. Subramanian (pp. 4 - 7)
Keywords: Coatings, Electronic engineering, Strain measurement
Article type: Research paper
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1711323 Effect of interconnection area on shear strength of sintered joint with nano-silver paste
Kun Qi, Xu Chen, Guo-Quan Lu (pp. 8 - 12)
Keywords: Shear strength, Sintering
Article type: Research paper
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1711324 Microstructural changes of lead-free solder joints during long-term ageing, thermal cycling and vibration fatigue
Andreas R. Fix, Wolfgang Nüchter, Jürgen Wilde (pp. 13 - 21)
Keywords: Ageing (materials), Diffusion, Solder, Soldering, Thermal testing, Vibration
Article type: Research paper
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1711325 Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders
R.S. Lai, K.L. Lin, B. Salam (pp. 22 - 26)
Keywords: Silver, Soldering, Solders, Time
Article type: Research paper
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New products

Article Id: Article Information:
1711339 New PS-900 soldering system delivers high power with superior thermal control
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1711340 PDR announced launch of modular rework system at Productronica 2007
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1711341 Revolutionary new water ingress protection process for electronic devices
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1711342 HumiSeal celebrated 50 years with a new water-based coating launch at Productronica 2007
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1711343 PhoenixjX-ray presented a variety of new products at Productronica
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1711344 Intertronics get stuck into the Love Truck
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1711345 OK International has introduced the MX-PTZ Precision Tweezer hand-piece for the Metcal MX-500 Soldering/Rework System
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1711346 Marantz Business Electronics previews new AOI platform at Productronica 2007
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Industry news

1711328 Novatec continued their tradition of breakthrough technologies at 2007 Productronica
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1711329 Assembléon establishes direct sales and services presence in Germany
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1711330 Exception's “gold standard” Fastrack service
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1711331 SMART power drives Nepcon: Reed Exhibitions and SMART Group announce partnership to jointly manage Nepcon UK
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1711332 SMTA announces their support of SMART Group at Nepcon UK 2008
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1711333 Contax announces an excellent 2007
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1711334 ASTM declarable substances subcommittee developing proposed tin-based solder alloys standard
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1711335 IPC certification moves Quantum CAD designers into PCB elite
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1711336 Launch of report: XRF Measurement of Residual Materials in Electronics
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1711337 The huge impact of printed transistors
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IeMRC System in Package Workshop

17096396 IeMRC System in Package Workshop
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Exhibition and conferences

1711338 Call for papers for China SMT Forum 2008 now open
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Editorial

1711326 Editorial
Martin Goosey
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Awards

1711327 Emerald ex-editor honoured by UN and USA
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