Online from: 1989
Subject Area: Electrical & Electronic Engineering
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|Title:||Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg)|
|Author(s):||John Lau, (Agilent Technologies, Inc., Santa Clara, California, USA), Jerry Gleason, (Hewlett-Packard Company, Palo Alto, California, USA), Valeska Schroeder, (Hewlett-Packard Company, Palo Alto, California, USA), Gregory Henshall, (Hewlett-Packard Company, Palo Alto, California, USA), Walter Dauksher, (Agilent Technologies, Inc., Santa Clara, California, USA), Bob Sullivan, (High Density Packaging Users Group, Scottsdale, Arizona, USA)|
|Citation:||John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan, (2008) "Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg)", Soldering & Surface Mount Technology, Vol. 20 Iss: 2, pp.11 - 20|
|Keywords:||Density, Lead, Low temperatures, Packaging processes, Solder|
|Article type:||Research paper|
|DOI:||10.1108/09540910810871520 (Permanent URL)|
|Publisher:||Emerald Group Publishing Limited|
|Acknowledgements:||The authors would like to thank those in the HDPUG who participated in the planning and execution of this project, Fay Hua, who initiated the project at HP and who is now at Intel, Joe Smetana of Alcatel who designed the test board, Sammy Yi and Arlington Lewis of Flextronics who provided assembly services, Swami Prasad of ChipPac, Helen Holder, HP; Geary Chew and Zequn Mei, formally of HP, and finally Ruben Bergman who provided project motivation and encouragement. The strong support of Ted Lancaster to the Agilent Lead-Free Program and Bill Leong and Judy Glazer to the HP RoHS Compliance program is greatly appreciated.|
Purpose – The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into process development and solder joint reliability of high-density packages on printed circuit boards using a low-melting temperature lead-free solder (Sn-57?wt%Bi-1?wt%Ag).
Design/methodology/approach – The components studied include several SMT package types and various lead configurations. The assembly process addresses the low-temperature lead-free assembly process, inspection and analysis of these boards and packages.
Findings – It was found that, the assembly process of the SnBiAg lead-free test boards is very robust and the assembly yield is almost 100 percent.
Originality/value – The paper is of value by presenting a description of the rationale and material set used for an experiment to test SMT assembly and reliability characteristics using the 57Bi-42Sn-1Ag alloy, which has a melting point of 139°C.
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