Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg)

John Lau; Jerry Gleason; Valeska Schroeder; Gregory Henshall; Walter Dauksher; Bob Sullivan

doi:10.1108/09540910810871539

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Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

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Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg)

Document Information:
Title:	Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg)
Author(s):	John Lau, (Agilent Technologies, Inc., Santa Clara, California, USA), Jerry Gleason, (Hewlett-Packard Company, Palo Alto, California, USA), Valeska Schroeder, (Hewlett-Packard Company, Palo Alto, California, USA), Gregory Henshall, (Hewlett-Packard Company, Palo Alto, California, USA), Walter Dauksher, (Agilent Technologies, Inc., Santa Clara, California, USA), Bob Sullivan, (High Density Packaging Users Group, Scottsdale, Arizona, USA)
Citation:	John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan, (2008) "Reliability test and failure analysis of high-density packages assembled with a low-temperature lead-free solder (SnBiAg)", Soldering & Surface Mount Technology, Vol. 20 Iss: 2, pp.21 - 29
Keywords:	Density, Lead, Low temperatures, Packaging processes, Solder
Article type:	Research paper
DOI:	10.1108/09540910810871539 (Permanent URL)
Publisher:	Emerald Group Publishing Limited
Acknowledgements:	The authors would like to thank those in the High Density Packaging Users Group who participated in the planning and execution of this project, Fay Hua, who initiated the project at HP and who is now at Intel, Joe Smetana of Alcatel who designed the test board, Sammy Yi and Arlington Lewis of Flextronics who provided assembly services, Swami Prasad of ChipPac, Helen Holder HP Geary Chew and Zequn Mei, formally of HP, and finally Ruben Bergman who provided project motivation and encouragement. The strong support of Ted Lancaster to the Agilent Lead-Free Program and Bill Leong and Judy Glazer to the HP RoHS Compliance program is greatly appreciated.
Abstract:	Purpose – The High Density Packaging Users Group Consortium has conducted a study of process development and solder-joint reliability of high-density packages on printed circuit boards (PCB) using a low-melting temperature lead-free solder. The purpose of this paper is to investigate the reliability tests (e.g. temperature cycling and shock and vibration) and failure analysis (FA) of high-density packages on PCB with the low-melting temperature lead-free solder (Sn-57?wt%Bi-1?wt%Ag). Design/methodology/approach – The design for reliability, materials, and assembly process aspects of the project have been discussed in “Design, materials, and assembly process of high-density packages with a low-temperature lead-free solder (SnBiAg)” also published in this journal issue. In this study, reliability tests (e.g. temperature cycling and shock and vibration) and FA of high-density packages on PCB with the low-melting temperature lead-free solder (Sn-57?wt%Bi-1?wt%Ag) are investigated. Findings – Lead-free solder-joint reliability of high-density packages, such as the PBGA388, PBGA256, PBGA208, PBGA196, PBGA172, PQFP80, and TSSOP56 were determined by temperature cycling, shock, and vibration tests. Temperature cycling test data for over 8,100 cycles between 0 and 100°C in a 44?min. cycle were statistically analyzed. Shock and vibration test data based on the HP Standard Class Bi-II Products SPEC have also been reported. Originality/value – Currently there is a lack of experimental and simulation data and field experience in respect of one of the critical issues for industry – that of solder joint reliability in lead-free soldering. The paper contains some important research results and recommendations.