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Journal cover: Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

Subject Area: Electrical & Electronic Engineering

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Table of contents:
Volume 20 issue 3

Published: 2008, Start page: p4

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Articles
Article Id: Article Information:
1732897 The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths
Ju Guo-kui, Wei Xi-cheng, Sun Peng, Liu Johan (pp. 4 - 10)
Keywords: Joining processes, Solders, Surface mount technology, Tensile strength
Article type: Research paper
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1732898 Characterization of Sn7In4.1Ag0.5Cu solder in lead-free composite solder joints of LTCC/PWB assembly
O. Nousiainen, T. Kangasvieri, R. Rautioaho, J. Vähäkangas (pp. 11 - 17)
Keywords: Alloys, Fatigue, Head, Solders, Thermal measurement
Article type: Research paper
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1732899 Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPs
Meng-Kuang Huang, Chiapyng Lee (pp. 18 - 25)
Keywords: Failure modes and effects analysis, Lead, Solders
Article type: Research paper
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1732900 A procedure for determining the high-speed stencil printing performance of solder pastes in an electronic service provider's environment
Christopher M. Greene, Krishnaswami Srihari (pp. 26 - 33)
Keywords: Alloys, Lead, Lead-free solder paste, Solder paste, Solders
Article type: Research paper
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1732901 Solder paste characterisation: towards the development of quality control (QC) tool
R. Durairaj, S. Mallik, N.N. Ekere (pp. 34 - 40)
Keywords: Creep, Flux, Quality control, Rheology, Solder paste, Viscosity
Article type: Research paper
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1732902 Silver thick film pastes for low temperature co-fired ceramics: impact of glass frit variation
Jayashri Bangali, Sunit Rane, Girish Phatak, Shashikala Gangal (pp. 41 - 46)
Keywords: Adhesion, Films (states of matter), Pastes, Sheets, Silver, Surface conductivity
Article type: Research paper
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New products

Article Id: Article Information:
1732916 DEK’s new InstinctivTM V9 software advances with HawkEyeTM control
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1732917 New ATF Vapour Phase soldering from Contax
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1732918 NEW MG-8R joined Assembléon’s A-Series Pick & Place machines at Nepcon Shanghai
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1732919 New Programmable Preheater lowers soldering and rework temperatures
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1732920 PDR launches accurate focussed IR rework in a handtool
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1732921 “ADHERE” LCD adhesives from make displays clear
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1732922 New MPM stencil printer from Contax
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1732923 Award-winning ProFlow® technology from DEK evolves to broaden capability and expand process window
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1732924 NPL-IPTM from NPL
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1732925 Computer-guided connector assembly
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1732926 Soldertec Global offers new “Same Day” X-ray inspection service
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1732927 Qualified stencils reduce setup errors DEK uses ScanCAD inspection system to certify stencil fabrication
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1732928 Enhanced software reduces setup time was introduced at APEX Stand 739 Step-by-step process improves efficiency
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International diary

1732915 International diary
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Industry news

1732906 DEK celebrates its 40th year
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1732907 OK International celebrates double awards in Asia
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1732908 HumiSeal® strengthens European presence with new Italian distribution agreement and signs new South African distribution agreement
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1732909 Siplace even more flexible and customer focused
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1732910 Contax Installs New Essemtec Line at Gemini 2000
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1732911 OK International collects Service Excellence Award at APEX 2008
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1732912 Economical high-volume Photo Etching is a reality
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1732913 Technology partnership between Assembléon and Valor
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1732914 KSR International chooses Genesis GC-120Q for high-volume assembly
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Editorial

1732903 Editorial
Martin Goosey
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Appointments

1732904 ASML Chief Executive Officer Eric Meurice accepts extension of contract
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1732905 DEK appoints new General Manager for the Americas
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