Search
  Advanced Search
 
Journal search
Journal cover: Soldering & Surface Mount Technology

Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

Subject Area: Electrical & Electronic Engineering

Content: Latest Issue | icon: RSS Latest Issue RSS | Previous Issues

Options: To add Favourites and Table of Contents Alerts please take a Emerald profile

Icon: .Table of Contents.Next article.Icon: .

The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths


Document Information:
Title:The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths
Author(s):Ju Guo-kui, (Key State Lab for New Displays and System Integration (Chinese Ministry of Education), Sino-Swedish Microsystem Integration Technology (SMIT) Centre, Shanghai University, Shanghai, People's Republic of China), Wei Xi-cheng, (Key State Lab for New Displays and System Integration (Chinese Ministry of Education), Sino-Swedish Microsystem Integration Technology (SMIT) Centre, Shanghai University, Shanghai, People's Republic of China and Key State Lab for New Displays and System Integration (Chinese Ministry of Education), Sino-Swedish Microsystem Integration Technology (SMIT) Centre, Shanghai University, Shanghai, People's Republic of China), Sun Peng, (Key State Lab for New Displays and System Integration (Chinese Ministry of Education), Sino-Swedish Microsystem Integration Technology (SMIT) Centre, Shanghai University, Shanghai, People's Republic of China SMIT Center, Chalmers University of Technology, Göteborg, Sweden), Liu Johan, (Key State Lab for New Displays and System Integration (Chinese Ministry of Education), Sino-Swedish Microsystem Integration Technology (SMIT) Centre, Shanghai University, Shanghai, People's Republic of China SMIT Center, Chalmers University of Technology, Göteborg, Sweden)
Citation:Ju Guo-kui, Wei Xi-cheng, Sun Peng, Liu Johan, (2008) "The comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu)/Cu joints during isothermal aging and their tensile strengths", Soldering & Surface Mount Technology, Vol. 20 Iss: 3, pp.4 - 10
Keywords:Joining processes, Solders, Surface mount technology, Tensile strength
Article type:Research paper
DOI:10.1108/09540910810885660 (Permanent URL)
Publisher:Emerald Group Publishing Limited
Acknowledgements:The authors would like to acknowledge the financial support provided by S&T Funding project of Shanghai Education Committee (No. 06AZ011) and Shanghai University Graduated Students' Creation Fund (2007).
Abstract:

Purpose – The purpose of this paper is to compare the growth kinetics of interfacial intermetallic compound (IMC) layer and its effect on the tensile strength of two solder (Sn3.0Ag0.5Cu and Sn0.4Co0.7Cu) joints.

Design/methodology/approach – The samples annealed, respectively, at 85, 120 and 150°C up to 1,000?h were tensile tested and their cross-sections were observed by scanning electron micrography.

Findings – The results showed that, for both solder joints, an approximately linear reduction in tensile joint strength with an increase in the IMC layers' thickness occurred. The tensile strength of Cu/Sn3.0Ag0.5Cu solder joints is slightly better than that of Cu/Sn-0.7Co-0.4Cu solder joints under analogous aging conditions. In addition, the growth kinetics of the overall interfacial IMC layer in Sn0.4Co0.7Cu solder joints can be simply described by the classical growth kinetic theory for solid-state diffusion with an activation energy of 2,996.85?J/mol and interdiffusion constant of 4.15×0-17?m2/s which are relatively lower, compared with Sn3.0Ag0.5Cu solder on copper with 14,167.8?J/mol and 65.33×10-17?m2/s, respectively.

Originality/value – The paper is of value in evaluating the growth kinetics of Sn3.0Ag0.5Cu and Sn0.4Co0.7Cu solder joints, and in discussing and contrasting the influence of IMC growth on their tensile strength.



Fulltext Options:

Login

Login

Existing customers: login
to access this document

Login


- Forgot password?
- Athens/Institutional login

Purchase

Purchase

Downloadable; Printable; Owned
HTML, PDF (243kb)Purchase

To purchase this item please login or register.

Login


- Forgot password?

Recommend to your librarian

Complete and print this form to request this document from your librarian


Marked list


Bookmark & share

Reprints & permissions