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Home > Soldering & Surface Mount Technology > Table of contents:Volume 21 issue 1
Soldering & Surface Mount Technology
ISSN: 0954-0911
Online from: 1989
Subject Area: Electrical & Electronic Engineering
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Table of contents:
Volume 21 issue 1
Published: 2009, Start page: p4Icon key: 
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You have access to this item Backfiles Earlycite Abstract only | Article Id: | Article Information: |
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| 1770749 | Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer Kyoo-Seok Kim, Jae-Pil Jung, Y. Norman Zhou (pp. 4 - 10) Keywords: Bonding, Joining processes, Printed circuits Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (262kb) ] | Reprints & permissions |
| 1770750 | Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging Stoyan Stoyanov, Chris Bailey, Marc Desmulliez (pp. 11 - 24) Keywords: Optimization, Product reliability, Prototypes, Techniques Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (913kb) ] | Reprints & permissions |
| 1770751 | Geometry control of solder interconnects via induction heating Hongbo Xu, Mingyu Li, Yonggao Fu, Ling Wang, Jongmyung Kim (pp. 25 - 30) Keywords: Circuit boards, Heating, Soldering Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (320kb) ] | Reprints & permissions |
| 1770752 | Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis Chang-Chun Lee, Kuo-Chin Chang, Ya-Wen Yang (pp. 31 - 41) Keywords: Finite element analysis, Joining processes, Solder Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (333kb) ] | Reprints & permissions |
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