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Home > Soldering & Surface Mount Technology > Table of contents:Volume 21 issue 3
Soldering & Surface Mount Technology
ISSN: 0954-0911
Online from: 1989
Subject Area: Electrical & Electronic Engineering
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Table of contents:
Volume 21 issue 3
Published: 2009, Start page: p4Icon key: 
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| 1795943 | Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints Yi-Shao Lai, C.R. Kao, Hsiao-Chuan Chang, Chin-Li Kao (pp. 4 - 9) Keywords: Impact strength, Joining processes, Soldering, Surface tension Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (324kb) ] | Reprints & permissions |
| 1795944 | Edge tail length effect on reliability of DBC substrates under thermal cycling Guangcheng Dong, Guangyin (Thomas) Lei, Xu Chen, Khai Ngo, Guo-Quan Lu (pp. 10 - 15) Keywords: Copper, Fatigue, High temperatures, Packaging, Substrates, Thermal properties of materials Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (201kb) ] | Reprints & permissions |
| 1795945 | Effect of substrate material and thickness on reliability of ACA bonded flip chip joints Laura Frisk, Anne Cumini (pp. 16 - 23) Keywords: Adhesives, Joining materials, Liquid crystal polymers, Reliability management, Substrates Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (247kb) ] | Reprints & permissions |
| 1795946 | Composite coating structure in an implantable electronic device Kati Kokko, Hanna Harjunpää, Pekka Heino, Minna Kellomäki (pp. 24 - 29) Keywords: Adhesives, Coatings technology, Flipchips, Joining materials Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (311kb) ] | Reprints & permissions |
| 1795947 | Reliability analysis of a novel fan-out type WLP Ming-Chih Yew, Mars Tsai, Dyi-Chung Hu, Wen-Kun Yang, Kuo-Ning Chiang (pp. 30 - 38) Keywords: Finite element analysis, Packaging, Predictive process, Reliability management, Stress (materials) Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (526kb) ] | Reprints & permissions |
| 1795948 | Six sigma analysis of SMD feeding parameters and board assembly quality Pekka Kytösaho, Timo Liukkonen (pp. 39 - 46) Keywords: Printed circuits, Six sigma, Surface mount technology Article type: Research paper Abstract | View HTML | View PDF (290kb) | Reprints & permissions |
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