Soldering & Surface Mount Technology

ISSN: 0954-0911

Online from: 1989

Subject Area: Electrical & Electronic Engineering

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Volume 21 issue 4

Published: 2009, Start page: p4

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Articles
Article Id:	Article Information:
1811447	Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective Kati Kokko, Hanna Harjunpää, Anna-Maija Haltia, Pekka Heino, Minna Kellomäki (pp. 4 - 11) Keywords: Adhesives, Coatings technology, Electrical conductivity, Joining materials, Materials with purpose Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (263kb) ] \| Reprints & permissions
1811448	Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints Martin Wickham, Ling Zou, Christopher Hunt (pp. 12 - 18) Keywords: Adhesives, Lead, Parts, Reliability management, Solders, Surface conductivity Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (539kb) ] \| Reprints & permissions
1811449	Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders T.K. Yeh, K.L. Lin, B. Salam (pp. 19 - 23) Keywords: Alloys, Alloys, Oxidation resistance, Silver, Solders Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (430kb) ] \| Reprints & permissions
1811450	On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters D. Di Maio, C.P. Hunt (pp. 24 - 31) Keywords: Alloys, Copper, Diffusion, Soldering, Solders Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (414kb) ] \| Reprints & permissions
1811451	Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno (pp. 32 - 37) Keywords: Alloys, Soldering, Solders, Thermal properties of materials Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (465kb) ] \| Reprints & permissions
1811452	Reflow profile optimization of µBGA solder joints considering reflow temperature and time coupling Tao Bo, Yin Zhouping, Ding Han, Wu Yiping (pp. 38 - 44) Keywords: Failure (mechanical), Joining materials, Reliability management, Soldering Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (261kb) ] \| Reprints & permissions
1811453	Local melt process of solder bumping by induction heating reflow Hongbo Xu, Mingyu Li, Yonggao Fu, Ling Wang, Jongmyung Kim (pp. 45 - 54) Keywords: Heating, Induction, Melting, Soldering Article type: Research paper Please login \| Abstract & purchase [ HTML & PDF (538kb) ] \| Reprints & permissions

New products

Article Id:	Article Information:
1811468	Siemens Electronics Assembly Systems introduces a placement machine with rail-mounted gantries that can be added or moved within only minutes Please login \| Abstract & purchase [ HTML ]
1811469	DEK launches Verification & Traceability Software Suite Please login \| Abstract & purchase [ HTML ]
1811470	Verotec extend range of 19″ modular general purpose and EMC rack cases Please login \| Abstract & purchase [ HTML ]
1811471	Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste Please login \| Abstract & purchase [ HTML ]
1811472	New sensor film range maps and measures extremely low-contact pressures Please login \| Abstract & purchase [ HTML ]
1811473	About Sensor Products Inc. (USA) Please login \| Abstract & purchase [ HTML ]
1811474	Intertronics Turbo-Coat – tack free in 3 min Please login \| Abstract & purchase [ HTML ] International diary
1811463	International diary Please login \| Abstract & purchase [ HTML ] Industry news
1811455	SURFENERGY – a new European project to help the PCB and surface finishing sectors Please login \| Abstract & purchase [ HTML ]
1811456	Alpha appoints Solder Connection Please login \| Abstract & purchase [ HTML ]
1811457	Rehm Thermal Systems signs distribution agreement with ENCON in Poland Please login \| Abstract & purchase [ HTML ]
1811458	CIL expands test facility Please login \| Abstract & purchase [ HTML ]
1811459	Rehm Thermal Systems signs agreement with ONBoard Solutions in Australia and New Zealand Please login \| Abstract & purchase [ HTML ]
1811460	Prodelectronic reaches an agreement with DEK to acquire the sales and manufacturing business in France Please login \| Abstract & purchase [ HTML ]
1811461	DEK US-based stencil operations receive official ITAR registration Please login \| Abstract & purchase [ HTML ]
1811462	OK International Soldering, Desoldering and Rework System wins again Please login \| Abstract & purchase [ HTML ] Editorial
1811454	Editorial Martin Goosey Abstract \| View HTML Conferences and exhibitions
1811464	Lead-Free Solders and Emerging Interconnect and Packaging Technologies at the 138th TMS Annual Meeting and Exhibition, 16-19 February 2009, Moscone West Convention Center, San Francisco, California, USA Professor Fu Guo Please login \| Abstract & purchase [ HTML ]
1811465	Printed Electronics Europe, 7-8 April 2009, Dresden, Germany John Ling Please login \| Abstract & purchase [ HTML ]
1811466	SMT/Hybrid/Packaging, 5-7 May 2009, Nürnberg, Germany John Ling Please login \| Abstract & purchase [ HTML ]
1811467	EIPC Summer Conference 2009, 18-19 June 2009 Martin Goosey Please login \| Abstract & purchase [ HTML ] Book review
1811475	Nanopackaging: Nanotechnologies and Electronics Packaging Martin Goosey Please login \| Abstract & purchase [ HTML ]