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Home > Soldering & Surface Mount Technology > Table of contents:Volume 22 issue 1
Soldering & Surface Mount Technology
ISSN: 0954-0911
Online from: 1989
Subject Area: Electrical & Electronic Engineering
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Table of contents:
Volume 22 issue 1
Published: 2010, Start page: p4Icon key: 
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You have access to this item Backfiles Earlycite Abstract only | Article Id: | Article Information: |
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| 1837662 | Activities during melting and reflowing behaviour of solders J. Mittal, K.L. Lin (pp. 4 - 10) Keywords: Alloys, Copper, Flow, Melting, Metals, Soldering Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (386kb) ] | Reprints & permissions |
| 1837663 | Effect of stand-off height on the microstructure and mechanical behaviour of solder joints Bo Wang, Fengshun Wu, Yiping Wu, Hui Liu, Longzao Zhou, Yuebo Fang (pp. 11 - 18) Keywords: Joining processes, Mechanical behaviour of materials, Soldering, Tensile strength Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (342kb) ] | Reprints & permissions |
| 1837664 | Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux Patrick Zerrer, Andreas Fix, Matthias Hutter, Herbert Reichl (pp. 19 - 25) Keywords: Alloys, Flux, Metals, Organic compounds, Solder, Solidification Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (240kb) ] | Reprints & permissions |
| 1837665 | X-ray solder alloy volume measurement (XSVM) in pin-in-paste technology (PIP) Mihály Janóczki, László Jakab (pp. 26 - 40) Keywords: Alloys, Solder, Solder paste, Volume measurement, X-rays Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (723kb) ] | Reprints & permissions |
| 1837666 | Moisture effects on adhesion of non-conductive adhesive attachments Kirsi Saarinen, Pekka Heino (pp. 41 - 46) Keywords: Adhesion, Electronic engineering, Joining processes, Moisture, Product reliability Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (95kb) ] | Reprints & permissions |
| 1837667 | An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies Guangbin Dou, David C. Whalley, Changqing Liu, Y.C. Chan (pp. 47 - 55) Keywords: Adhesives, Assembly, Bonding, Flipchips, Joining processes Article type: Research paper Please login | Abstract & purchase [ HTML & PDF (423kb) ] | Reprints & permissions |
| 1837668 | Tin pest in lead-containing solders W.J. Plumbridge (pp. 56 - 57) Keywords: Alloys, Joining processes, Lead, Solder Article type: Technical paper Please login | Abstract & purchase [ HTML & PDF (109kb) ] | Reprints & permissions |
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