Online from: 1989
Subject Area: Electrical & Electronic Engineering
Options: To add Favourites and Table of Contents Alerts please take a Emerald profile
|Title:||Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder joints|
|Author(s):||Wenzhen Bi, (School of Materials Science and Engineering, Shanghai University, Shanghai, China), Guokui Ju, (School of Materials Science and Engineering, Shanghai University, Shanghai, China), Fei Lin, (School of Materials Science and Engineering, Shanghai University, Shanghai, China), Shifang Xie, (Institute of Applied Physics, Jiangxi Academy of Sciences, Nanchang, China), Xicheng Wei, (School of Materials Science and Engineering, Shanghai University, Shanghai, China)|
|Citation:||Wenzhen Bi, Guokui Ju, Fei Lin, Shifang Xie, Xicheng Wei, (2012) "Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu solder joints", Soldering & Surface Mount Technology, Vol. 24 Iss: 4, pp.249 - 256|
|Keywords:||Alloys, Fracture mode, IMC, Lead-free, Low-silver, Packaging, Solders, Tensile strength, Thermal aging, Thickness|
|Article type:||Research paper|
|DOI:||10.1108/09540911211262539 (Permanent URL)|
|Publisher:||Emerald Group Publishing Limited|
|Acknowledgements:||The work was carried out with the support of the Opening Foundation from Jiangxi Key Laboratory of Advanced Copper and Tungsten Materials, Jiangxi Academy of Sciences (contract no. 2010-WT-02) and the Foundation for Innovation in Shanghai University (contract no. SHUCX112262).|
Purpose – In a previous study, the authors proposed a new low-silver solder alloy Sn- x(1.0, 1.5, 2.0)Ag-0.3Cu-3.0Bi-0.05Er (wt.%) (SACBE) and the purpose of this paper is to provide additional useful information for new solder alloy development. The growth behaviour of the interfacial IMC layers for Cu/SACBE/Cu and Cu/SAC/Cu joints and their bonding strengths after thermal aging at 150°C for 0, 24, 168 and 500?hours are investigated and the effects of adding elemental Bi and Er on the growth of interfacial IMC layers in the joints, and their tensile properties, are characterized and discussed.
Design/methodology/approach – The tensile properties of the Cu/Sn-3.0Ag-0.5Cu/Cu (Cu/SAC/Cu) and Cu/SACBE/Cu joints during thermal aging at 150°C for 0, 24, 168 and 500?hours were investigated, respectively. The thickness of interfacial IMC layer and the fracture surface of solder joint after isothermal aging were observed and analyzed by means of scanning electron micrograph (SEM) equipped with an energy dispersive spectroscopy X-ray (EDX) analysis system.
Findings – It was found that the thickness of the IMC layer at the interface of a Cu/SACBE/Cu joint was remarkably thinner than that of a Cu/SAC/Cu joint. The addition of Bi and Er could significantly improve the tensile properties of the solder joint and enhance its resistance to high temperature aging. A mixture of ductile and brittle fracture mode was observed after tensile testing in the Cu/SACBE/Cu joints.
Originality/value – The paper implies that the addition of Bi and Er could complement effectively the effects of Ag, thereby reducing the cost of solder. The low-silver SACBE solder is a potential alloy for electronic packaging production.
To purchase this item please login or register.
Complete and print this form to request this document from your librarian