Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder

Peng Xue; Songbai Xue; Yifu Shen; Zhengxiang Xiao; Hong Zhu; Weimin Long; Xinquan Yu

doi:10.1108/09540911211262566

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Soldering & Surface Mount Technology

ISSN: 0954-0911

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Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder

Document Information:
Title:	Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder
Author(s):	Peng Xue, (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China), Songbai Xue, (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China), Yifu Shen, (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China), Zhengxiang Xiao, (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China), Hong Zhu, (The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing, China), Weimin Long, (The State Key Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering), Henan, China), Xinquan Yu, (The State Key Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering), Henan, China)
Citation:	Peng Xue, Songbai Xue, Yifu Shen, Zhengxiang Xiao, Hong Zhu, Weimin Long, Xinquan Yu, (2012) "Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder", Soldering & Surface Mount Technology, Vol. 24 Iss: 4, pp.280 - 286
Keywords:	Alloys, Mechanical properties of materials, Metals, Praseodymium, Sn whisker, Solders, Tin-Zinc, Wettability
Article type:	Research paper
DOI:	10.1108/09540911211262566 (Permanent URL)
Publisher:	Emerald Group Publishing Limited
Acknowledgements:	This work (No. SKLABFMT201102) was supported by the State Key Laboratory of Advanced Brazing Filler Metals & Technology (Zhengzhou Research Institute of Mechanical Engineering), China.
Abstract:	Purpose – The purpose of this paper is to improve the properties of Sn-9Zn solder, so as to meet the requirements of industrial applications. Design/methodology/approach – The effects of Praseodymium on property and Sn whisker growth under aging treatment in Sn-9Zn lead-free solder were investigated. Findings – The results indicate that with the addition of rare earth Pr, the wettability and mechanical properties of Sn-9Zn solder were improved. The best wettability and comprehensive property of soldered joint is obtained when the content of Pr is 0.08?wt.%. After aging treatment at 150°C for 360?h, the mechanical properties of Sn-9Zn-0.08Pr decreased but are still obviously higher than that of Sn-9Zn. Moreover, when the content of Pr reached 0.1?wt.%, plenty of Sn-Pr compounds were found in the Sn-9Zn solder. The inevitable oxidation of Sn-Pr compounds would cause a high stress accumulated within PrSn3 phases, which would be served as driving force to induce the Sn whisker sprout and growth after aging treatment at 150°C for 120?h to 360?h. Compared with the results in Sn-9Zn-0.5Ga-0.7Pr solder that Sn whisker observed until the addition of Pr reached 0.7?wt.%, it could be inferred that the addition of Ga may react against the sprout of Sn whisker. Originality/value – It is found that the addition of Pr can improve the properties of solder and avoid Sn whisker growth in the right range and proper conditions. The cost of the solder with added Pr is limited to RMB 2?yuan/kg so it can be widely used in industry.