Microelectronics International

ISSN: 1356-5362

Online from: 1982

Subject Area: Electrical & Electronic Engineering

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Volume 30 issue 3 - Latest Issue

Published: 2013

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Article Id:	Article Information:
17087708	Design of Low-noise CMOS Transimpedance Amplifier Joon Huang Chuah, David Holburn Article type: Research paper Please login [ PDF (1921kb) ]
17088181	Three axial Low Temperature Cofired Ceramic accelerometer Dominik Jurków Article type: Research paper Please login [ PDF (1916kb) ]
17087782	Study of frequency dependent electrical properties of ZnO Nanorods Muhammad Kashif, Uda Hashim Article type: Research paper Please login [ PDF (685kb) ]
17087736	Study on the Fluid–Structure Interaction of Flexible Printed Circuit Board Motherboard in Personal Computer Casings Wei Chiat Leong, M. Z. Abdullah, C. Y. Khor, Dadan Ramdan Article type: Research paper Please login [ PDF (1918kb) ]
17087704	Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method Chun-Sean Lau, M. Z. Abdullah, C. Y. Khor Article type: Research paper Please login [ PDF (3649kb) ]
17087729	Superior Performance and Reliability of Copper Wire Ball bonding in Laminate Substrate Based Ball Grid Array Chong Leong Gan, Classe Francis, Uda Hashim Article type: Research paper Please login [ PDF (843kb) ]
17087741	Tin Contamination in PQFN Package and Its Effects on Wire Bondability Fei Zong, Zhi-jie Wang, Yan-bo Xu, Ji-yong Niu, Han-min Zhang Article type: Research paper Please login [ PDF (3582kb) ]

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