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Journal cover: Microelectronics International

Microelectronics International

ISSN: 1356-5362

Online from: 1982

Subject Area: Electrical & Electronic Engineering

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Table of contents:
Volume 24 issue 1

Published: 2007, Start page: p4

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Articles
Article Id: Article Information:
1593467 Design of an asynchronous least common multiple circuit
V. Bansal, A. Nandy, K.T. Lau (pp. 4 - 7)
Keywords: Circuit properties, Circuits
Article type: Research paper
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1593468 Studies on electrical properties of polymer thick film resistors
Y. Srinivasa Rao (pp. 8 - 14)
Keywords: Electrical resistivity, Films (states of matter), Temperature
Article type: Research paper
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1593469 Modifying electric artworks to improve dimensional stability of microelectronic substrates
Parsaoran Hutapea, Joachim L. Grenestedt (pp. 15 - 22)
Keywords: Deformation, Finite element analysis, Substrates
Article type: Research paper
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1593470 Effects of die-pad resonance on ultrasonic bond quality of wire bonds
Narasimalu Srikanth (pp. 23 - 26)
Keywords: Bonding, Deformation, Plastic analysis
Article type: Research paper
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1593471 Modeling and simulation of NTC thick film thermistor geometries
O.S. Aleksic, B.M. Radojcic, R.M. Ramovic (pp. 27 - 34)
Keywords: Electrical resistivity, Films (states of matter)
Article type: Research paper
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1593472 ?/2 Microstrip rejection filter behavior due to ferrite thin film overlay in the absence of external magnetic field
Vandan Surve, Vijaya Puri (pp. 35 - 39)
Keywords: Electronic equipment and components, Microwave circuits, Thin films
Article type: Research paper
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1593473 Voltage scaling – a novel approach for crosstalk reduction in global VLSI interconnects
B.K. Kaushik, S. Sarkar, R.P. Agarwal, R.C. Joshi (pp. 40 - 45)
Keywords: Electronic equipment and components, Simulation, Voltage fluctuations
Article type: Research paper
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1593474 Study of the effect of substrate bias on the electrical properties of sputtered HfO2 thin film deposited on silicon substrate
R.K. Nahar, Aparna Sharma (pp. 46 - 48)
Keywords: Electrical conductivity, Substrates, Thin films
Article type: Research paper
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1593475 Investigations of mechanical strength and electrical resistance of adhesives and adhesive joints in liquid nitrogen
B. Bober, A. Bochenek, B. Olszewska-Mateja, Z. Zaluk (pp. 49 - 53)
Keywords: Adhesives, Electrical resistivity, Shear strength
Article type: Research paper
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Note from the publisher

Article Id: Article Information:
1593477 Emerald at 40
Rebecca Marsh
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New products

1593486 Hamlin launches versatile hall effect geartooth sensor for automotive grade applications
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1593487 New image processing development platform empowers system designers
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1593488 EMC filters: UL/cUL approval for new two-line SIFI-H filters
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1593489 Testing times: Preventing water vapour from making electronics fail
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1593490 Strategic Test announces world's smallest "Monahans P" (PXA290) embedded SOM
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1593491 The MathWorks announces major upgrades of control design software
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1593492 Digital milliohmmeter combines versatility and accuracy
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1593493 Welwyn announces new ULR series
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Internet commentary

1593494 Internet commentary
Brian Ellis
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Industry news

1593478 iSLI hosts event to welcome new students
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1593479 MCE offers finer geometry ASICs for hand held devices
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1593480 Laird Technologies establishes presence in India
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1593481 iSLI makes industry-standard, electronic design software available to startups in Scotland
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1593482 New home for Innos at Southampton technology site
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1593483 "More Moore" shows European EUV innovation at EUV 2006 in Barcelona
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Editorial

1593476 Sixty years of electronics
Brian Ellis
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Appointments

1593484 Pickering Interfaces hires new UK and Ireland Sales Manager
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1593485 Dialight Lumidrives appoints new sales manager
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