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Journal cover: Microelectronics International

Microelectronics International

ISSN: 1356-5362

Online from: 1982

Subject Area: Electrical & Electronic Engineering

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Table of contents:
Volume 28 issue 3

Published: 2011, Start page: p3

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Articles
Article Id: Article Information:
1943802 Catalyst-free growth and characterization of ZnO nanoscrewdrivers prepared by thermal evaporation
L.S. Chuah, Z. Hassan, S.S. Tneh, M.A. Ahmad, S.K. Mohd Bakhori, Y. Yusof (pp. 3 - 6)
Keywords: SEM, Silicon, X-rays, Zinc oxide, ZnO nanoscrewdrivers
Article type: Research paper
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1943717 Effect of sputtering time on physical and electrical properties of ZrOx thin film on Si
K. Tedi, K.Y. Cheong, Z. Lockman (pp. 7 - 11)
Keywords: Silicon, Sputtering deposition, Thermal oxidation, Zirconium, Zirconium dioxide
Article type: Research paper
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1943743 Parametric study of efficient thermal dissipation in an LED back light unit
Jin Taek Kim, Cheul Ro Lee, Daesuk Kim, Byung Joon Baek (pp. 12 - 18)
Keywords: Back light unit, Heat spreader, Junction temperature, Light emission, Light emitting diodes, Light guide panel, Metal-core PCB, Printed-circuit boards, Thermal dissipation
Article type: Research paper
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1943565 Deformations in stretched surface mounted ceramic strips for sensor applications
Walter Gschohsmann, Johann Nicolics, Ephraim Suhir (pp. 19 - 23)
Keywords: Ceramic sensor strip model, Deformation, Sensors, Stress-strain distribution, Stretched strips
Article type: Research paper
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1943789 Polysilicon nanogap structure development using size expansion technique
Uda Hashim, Nazwa Taib, Thikra S. Dhahi, Azizullah Saifullah (pp. 24 - 30)
Keywords: Biosensor, Capacitors, Dielectric capacitor, Electrodes, Lateral nanogap, Lithography, Oxide semiconductor, Polysilicon
Article type: Research paper
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1943822 Design study for a capacitive ceramic pressure sensor
Marina Santo Zarnik, Darko Belavic, Srecko Macek (pp. 31 - 35)
Keywords: 3D LTCC structure, Capacitive pressure sensor, Capacitive-to-digital conversion, Electrodes, Sensors
Article type: Research paper
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1943614 Effective optimization of integrated circuits with embedded passive modules by applying semisymbolic LCS AC analysis method
Franciszek Balik (pp. 36 - 42)
Keywords: Circuits, IC sizing, Integrated circuits, Large-change sensitivity AC analysis, Passive modules optimization
Article type: Research paper
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1943663 Thick-film photoimageable and laser-shaped arms for thermoelectric microgenerators
Piotr Markowski (pp. 43 - 50)
Keywords: Inks, Laser shaping, Microgenerator, Miniaturization, Photoimageable, Renewable energy, Thick-film
Article type: Research paper
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1943759 Comparison of results from empirical ALT test to CAE simulation for wireless clients
Chien-Yi Huang, Hui-Hua Huang (pp. 51 - 59)
Keywords: Accelerated life testing, Computer aided engineering, Printed circuits, Product development, Temperature cycling, Wireless clients
Article type: Research paper
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New products

Article Id: Article Information:
1943756 Achronix and Mentor Graphics provide state-of-the-art physical synthesis support for Speedster22i FPGAs
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1943668 ADLINK Technology introduces fastest SATA 6 Gb/s industrial grade solid-state drives
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1943678 Cadence announces availability of world’s first DDR4 IP solution
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1943683 Fine-pitch bump adapters from Aries allow for SMT adaptation of TSSOP, QFP and other fine-pitch devices
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1943584 Wilocity tapes-out multi-gigabit wireless communication SoC using Synopsys DesignWare IP
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1943613 GCR glueable chip resistor family from 0805 to 2512 sizes target high-temperature, high-reliability and non-magnetic electronics
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1943633 Fairchild Semiconductor achieves first-pass silicon success with DesignWare USB 2.0 nanoPHY IP
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1943794 Cadence further defines and extends its SoC realization strategy
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1943814 Resistors optimised for conductive adhesive bring tiny SMD outlines to specialised applications
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International diary

1943588 International diary
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Industry news

1943747 Fab Owners Association totals 74 with new members
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1943623 Intense interest in energy harvesting for electric vehicles
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1943627 The aftermath of the Japanese earthquake what are implications for the global electronics industry?
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1943641 Synopsys and Varian collaborate on process models for advanced logic and memory technologies
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1943764 Camtek selected as advanced TEM sample preparation solution provider
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1943810 Global manufacturing quality control 2011 engineering studies for electronic component manufacturers’ test-intensive assembly lines now available from InterTech Development Company
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1943563 Anglia appointed as a Taiwan Semiconductor UK distributor
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Conferences and exhibitions

1943710 IEEE Workshop on Reliability & Safety Supported by iMAPS UK and NMI University of GreenwichLondon14 April 2011
John Ling
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1943797 Printed Electronics 2011 Düsseldorf Germany 5 and 6 April
John Ling
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1943803 IC Package Innovation: Choosing the Right Solution TWI, Granta Park, Abington, Cambridge 26 May 2011
Martin Goosey
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Appointments

1943751 Humiseal appoints new Global Business Director
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