---

Editorial team

Editor

Professor Martin Goosey
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough, LE11 3TU, UK
m.goosey@lboro.ac.uk

Associate Editor

John Ling, Consultant, UK

Managing Editor

Mark Wade
mwade@emeraldinsight.com

Publisher

Jane Ma
jma@emeraldinsight.com

Editorial Advisory Board

Dag Andersson, Swerea IVF AB, Sweden
Frank Bai, TPCA, Taiwan (Republic of China)
Martin Bayes, The Dow Chemical Company, USA
Bill Birch, PWB Interconnect Solutions Inc., Canada
Frank Cala, FR Cala Consulting, LLC, USA
Zhong Chen, Nanyang Technological University, Singapore
Andy Cobley, The Sonochemistry Centre at Coventry University, UK
Paul Comer, Graphic Plc, UK
Martin Cotton, Sanmina - SCI, Germany
Walt Custer, Custer Consulting Group, USA
John Everett, Dow Deutschland GmbH & Co OHG, Switzerland
Joseph Fjelstad, Verdant Electronics, USA
Fu Guo, Beijing University of Technology, People's Republic of China
Happy Holden, Foxconn Technology Group, Taiwan
David Hutt, Loughborough University, UK
Raymund Kwok, Foxconn, Hong Kong
Fu Lianyu, Shenzhen Jinzhou Precision Technology Corp, People's Republic of China
George Milad, Uyemura, USA
Alun Morgan, Isola Werke UK Ltd, UK
Neil Patton, Atotech Deutschland GmbH, Germany
Dennis Price, Merlin Circuit Technology, UK
Tarja Rapala-Virtanan, Meadville Group, People's Republic of China
Bahgat Sammakia, Binghamton University, USA
Pete Starkey, Institute of Circuit Technology, UK
Francesca Stern, BPA Consulting, UK
Gitachari Sudarsanam, Fine Line Circuits Ltd, India
John Walker, Institute of Circuit Technology, UK
Michael Weinhold, European Institute of Printed Circuits, Netherlands

* 2011 Journal Citation Reports® (Thomson Reuters, 2012)

.

 |  |