Login
Guest
Search for:
Browse:
Resources:
Microelectronics International
An International Journal
ISSN: 1356-5362
Ranked by Thomson Reuters (ISI)
Full text online
Content: Table of Contents | Latest Issue RSS 
Information: Journal information | Editorial Team | Author Guidelines
Other: Events | Recommend this journal
Journal history
Previously published as Hybrid Circuits
Follow the Table of Contents link above for previous content.
Emerald EarlyCite
This journal is pre-published through Emerald EarlyCite. Issues are made available before the official publication date - look for the EarlyCite symbol
on the journal's table of contents page. If no EarlyCite issues are available, this indicates recent official publication.
Editorial objectives
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Topicality
State-of-the-art, in-depth technical papers and editorials are complimented by international industry trends, society news, new products and a diary of international events.
Key benefits
The journal comprises a multi-disciplinary study of the various technologies, processes and current practices associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages.
Key journal audiences
Microelectronics International represents a comprehensive and authoritative information source for research, application and current awareness purposes for researchers, senior technical staff and practising engineers within industry and researchers and academics within universities.
Scope/Coverage
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturised electronic devices and advanced packages. Among the broad range of topics covered are:
- advanced packaging
- ball grid array (BGA)
- ceramics
- chip attachment
- chip on board (COB)
- chip scale packaging (CSP)
- dieing
- land grid array (LGA)
- micro-circuit technology
- multichip modules (MCMs)
- scribing
- semiconductor technology
- thick/thin film technology
Indexing and abstracting services
Microelectronics International is indexed and abstracted in leading service providers, including:
- CSA Technology Research Database
- CSA Engineering Research Database
- CSA High Technology Research Database with Aerospace
- CSA Materials Research Database with METADEX
- Inspec
- ProQuest Science Journals
- Recent Advances in Manufacturing Database (RAM)
- Referativnyi Zhurnal
- Scopus
- Thomson Scientific
- Science Citation Index Expanded (SciSearch®)
- Journal Citation Reports/Science Edition
- Current Contents® /Engineering, Computing, and Technology
- Materials Science Citation Index®
- Zetoc Electronic Table of Contents
Microelectronics International is available as part of an online subscription to the Emerald Electrical and Electronic Engineering Subject Collection. For more information, please email collections@emeraldinsight.com.
This journal is a member of and subscribes to the
principles of the Committee on Publication Ethics.
|
|
