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Packing density of inkjet printed paths

Grzegorz Tomaszewski (Department of Electronic and Telecommunications Systems, Rzeszów University of Technology, Rzeszów, Poland)
Jerzy Potencki (Department of Electronic and Telecommunications Systems, Rzeszów University of Technology, Rzeszów, Poland)
Tadeusz Wałach (Department of Electronic and Telecommunications Systems, Rzeszów University of Technology, Rzeszów, Poland)

Circuit World

ISSN: 0305-6120

Article publication date: 15 January 2018

Issue publication date: 12 February 2018

178

Abstract

Purpose

This paper aims to study the packing density of printed paths on different substrate materials. It presents problems which appear when the necessity of printing one or more narrow paths occurs.

Design/methodology/approach

A piezoelectric printhead containing nozzles with a diameter of 35 µm was used for printing nanoparticle silver ink on different polymer substrates which were treated by plasma or not treated at all. The shape, defects, resistance and printing parameters for the printed paths were analysed.

Findings

The obtained results allow the identification of the sources of the technological problems in obtaining a high packing density of the paths in a small area of substrate and the repeatable prints.

Research limitations/implications

The study could have limited universality because of the chosen research method; printhead, ink, substrate materials and process parameters were arbitrarily selected. The authors encourage the study of other kinds of conductive inks, treatment methods and printing process parameters.

Practical implications

The study includes practically useful information about widths, shapes, defects and the resistance of the paths printed using different technological parameters.

Originality/value

The study presents the results of original empirical research on problems of the packing density of inkjet printed paths on a small area of substrate and identifies problems that must be resolved to obtain effective interconnections in the inkjet technology.

Keywords

Acknowledgements

The work was developed by using the equipment purchased under Grants No. POPW.01.03.00-18-012/09-00 and UDA-RPPK.01.03.00-18-003/10-00. Results of NCBR Grant No. PBS1/A3/3/2012 and Statutory Activity of RUT were applied in this work. The authors would like to thank Emilien Leonhardt from Hirox Europe LTD. for his help in profile measurement.

Citation

Tomaszewski, G., Potencki, J. and Wałach, T. (2018), "Packing density of inkjet printed paths", Circuit World, Vol. 44 No. 1, pp. 21-28. https://doi.org/10.1108/CW-10-2017-0055

Publisher

:

Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

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