Influential mechanism of printed circuit board properties on micro hole drilling temperature
ISSN: 0305-6120
Article publication date: 10 May 2018
Issue publication date: 16 July 2018
Abstract
Purpose
The purpose of this paper was to study the influence of properties of printed circuit boards (PCBs) on the temperature during micro drilling and obtain the influential mechanism of PCBs based on temperature measurement.
Design/methodology/approach
Experiments were carried out to study the influence mechanism of PCB properties on micro hole drilling temperature under high spindle speed. The temperature measurement platform was applied, then the influence of components ratio of PCBs on the temperature of micro-drilling was analyzed by using comparative analysis method. The mass ratio of each kind of material in the PCB was defined as four levels and the influence mechanism of properties of PCBs based on temperature measurement was summarized.
Findings
Average filler and lower resin would have a positive impact on micro hole drilling temperature, and the smaller filler size and the even distribution would make it better.
Originality/value
An infrared temperature measurement platform was applied and influential mechanism of PCB properties on temperature was analyzed, which could provide the reference value on the optimization of temperature during micro drilling.
Keywords
Acknowledgements
The research is funded by the Project of Shenzhen Science and Technology Innovation, China, with the Project Number of JCYJ20170817101008562. The authors would also like to thank Shenzhen Jinzhou Precision Technology Corp., Ltd. for experiments support. The work was supported by the Fund of Shenzhen Science and Technology Innovation in Shenzhen (JCYJ20170817101008562), the National Natural Science Foundation of China (No. 51605304), the China Postdoctoral Science Foundation (No. 2016M601423), the PhD Start-up Fund of Natural Science Foundation of Guangdong Province (No. 2016A030310036), the Science and Technology Innovation Commission Shenzhen (Nos JCYJ20170412111216258 and JCYJ20160422162907121) and the Natural Science Foundation of Shenzhen University (No. 2017034).
Citation
Shi, H., Lin, X., Yan, Q. and Liang, X. (2018), "Influential mechanism of printed circuit board properties on micro hole drilling temperature", Circuit World, Vol. 44 No. 3, pp. 125-131. https://doi.org/10.1108/CW-12-2017-0070
Publisher
:Emerald Publishing Limited
Copyright © 2018, Emerald Publishing Limited