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Influential mechanism of printed circuit board properties on micro hole drilling temperature

Hongyan Shi (Guangdong Provincial Key Laboratory of Micro/Nano Optomechatronics Engineering, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen, China)
Xiaoke Lin (Guangdong Provincial Key Laboratory of Micro/Nano Optomechatronics Engineering, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen, China)
Qiuxin Yan (Guangdong Provincial Key Laboratory of Micro/Nano Optomechatronics Engineering, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen, China)
Xiong Liang (Guangdong Provincial Key Laboratory of Micro/Nano Optomechatronics Engineering, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen, China)

Circuit World

ISSN: 0305-6120

Article publication date: 10 May 2018

Issue publication date: 16 July 2018

102

Abstract

Purpose

The purpose of this paper was to study the influence of properties of printed circuit boards (PCBs) on the temperature during micro drilling and obtain the influential mechanism of PCBs based on temperature measurement.

Design/methodology/approach

Experiments were carried out to study the influence mechanism of PCB properties on micro hole drilling temperature under high spindle speed. The temperature measurement platform was applied, then the influence of components ratio of PCBs on the temperature of micro-drilling was analyzed by using comparative analysis method. The mass ratio of each kind of material in the PCB was defined as four levels and the influence mechanism of properties of PCBs based on temperature measurement was summarized.

Findings

Average filler and lower resin would have a positive impact on micro hole drilling temperature, and the smaller filler size and the even distribution would make it better.

Originality/value

An infrared temperature measurement platform was applied and influential mechanism of PCB properties on temperature was analyzed, which could provide the reference value on the optimization of temperature during micro drilling.

Keywords

Acknowledgements

The research is funded by the Project of Shenzhen Science and Technology Innovation, China, with the Project Number of JCYJ20170817101008562. The authors would also like to thank Shenzhen Jinzhou Precision Technology Corp., Ltd. for experiments support. The work was supported by the Fund of Shenzhen Science and Technology Innovation in Shenzhen (JCYJ20170817101008562), the National Natural Science Foundation of China (No. 51605304), the China Postdoctoral Science Foundation (No. 2016M601423), the PhD Start-up Fund of Natural Science Foundation of Guangdong Province (No. 2016A030310036), the Science and Technology Innovation Commission Shenzhen (Nos JCYJ20170412111216258 and JCYJ20160422162907121) and the Natural Science Foundation of Shenzhen University (No. 2017034).

Citation

Shi, H., Lin, X., Yan, Q. and Liang, X. (2018), "Influential mechanism of printed circuit board properties on micro hole drilling temperature", Circuit World, Vol. 44 No. 3, pp. 125-131. https://doi.org/10.1108/CW-12-2017-0070

Publisher

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Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

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