Implementing solid solder deposits (SSDs) in PCB manufacture

Abstract

Solid solder deposit (SSD) technology was developed in the early to mid‐1990s to improve first pass yields in the manufacture of electronic devices. Examines the SSD process and how this technology differs from a transfer of the paste printing process from the assembly site to the board fabricator. Other questions considered include what design considerations should be addressed in implementing SSDs, what the benefits are for the end‐user, what types of product are best suited to SSD, and how a board fabricator should implement this technology in a manufacturing environment.

Citation

DeBlis, J. (2002), "Implementing solid solder deposits (SSDs) in PCB manufacture", Circuit World, Vol. 28 No. 1, pp. 10-14. https://doi.org/10.1108/03056120210407694