An introduction to laser direct imaging for high density interconnects
Udi Omer
(Image Product Line, Orbotech Pacific Ltd, Hong Kong)
332
Abstract
This paper gives a short introduction to the features of laser direct imaging (LDI) that make it a valuable technology for high density interconnect (HDI) manufacturing. Outlines the benefits and indicates that LDI is a viable, production proven solution for HDI imaging.
Keywords
Citation
Omer, U. (2003), "An introduction to laser direct imaging for high density interconnects", Circuit World, Vol. 29 No. 1, pp. 32-35. https://doi.org/10.1108/03056120310444160
Publisher
:MCB UP Ltd
Copyright © 2003, MCB UP Limited