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Hollow Fibres in PCB, MCM‐L and PBGA Laminates May Induce Reliability Degradation

A. Shukla (CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA)
M. Pecht (CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA)
J. Jordan (CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA)
K. Rogers (CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA)
D. Jennings* (*Collins Commercial Avionics, Cedar Rapids, Iowa, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 1997

200

Abstract

The presence of hollow fibres in laminates used in printed circuit boards, multichip module laminated substrates, and plastic ball grid arrays has a potentially significant impact on reliability. Hollow fibres are vacuous glass filaments in E‐glass laminate reinforcements and are seen as a reliability problem since they can provide paths for failure mechanisms such as conductive filament formation. This paper discusses the manufacture of woven fabric laminates and the cause of hollow fibres. Experiments conducted to assess the occurrence of hollow fibres in laminates are then presented along with the key reliability issues.

Keywords

Citation

Shukla, A., Pecht, M., Jordan, J., Rogers, K. and Jennings*, D. (1997), "Hollow Fibres in PCB, MCM‐L and PBGA Laminates May Induce Reliability Degradation", Circuit World, Vol. 23 No. 2, pp. 5-6. https://doi.org/10.1108/03056129710800116

Publisher

:

MCB UP Ltd

Copyright © 1997, MCB UP Limited

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