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Numerical modeling of the coupled electromagnetic and thermal fields in the controlled solidification process

Ştefan Nagy (Faculty of Electrical Engineering and Information Technology, University of Oradea, Oradea, Romania)
Teodor Leuca (Faculty of Electrical Engineering and Information Technology, University of Oradea, Oradea, Romania)
Claudiu Mich (Faculty of Electrical Engineering and Information Technology, University of Oradea, Oradea, Romania)
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Abstract

Purpose

The purpose of this paper is to present the numerical modeling of the coupled electromagnetic and thermal fields for the controlled solidification process of non‐ferrous alloys.

Design/methodology/approach

The paper uses a numerical modeling program for the controlled solidification process modeling to allow visualization of the model and collection of the data. The data are then processed using spreadsheets in order to obtain graphic representations for the variations of the measured values.

Findings

The probes cast using this method will have a uniform structure, without micro‐fissures. If the solid part growth of the molten is controlled, the process can be stopped that creates solidification centers, thus the material structure will be homogenous. A solution for this matter is given by the control of the solidification structure using forced heating of the liquid part with eddy currents and forced cooling of the solid part. The evolution of the area with eddy currents and the cooled one controls the phase transformation.

Originality/value

It is presented here a computation method for the thermal field diffusion and the results of the numerical modelling of the thermal and electromagnetic fields during casting process with controlled solidification layer for the non‐ferrous alloys.

Keywords

Citation

Nagy, Ş., Leuca, T. and Mich, C. (2010), "Numerical modeling of the coupled electromagnetic and thermal fields in the controlled solidification process", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 29 No. 5, pp. 1266-1275. https://doi.org/10.1108/03321641011061470

Publisher

:

Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited

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