Finite element analysis of transient electromagnetic‐thermal phenomena in a squirrel cage motor
ISSN: 0332-1649
Article publication date: 10 May 2011
Abstract
Purpose
The purpose of this paper is to elaborate the method and algorithm for the analysis of electromagnetic and thermal transients in a squirrel cage induction motor.
Design/methodology/approach
The paper presents the special software for transient finite element (FE) analysis of coupled electromagnetic‐thermal problems in a squirrel cage induction motor. The software has been prepared and is successfully applied in the design of special squirrel cage motors, e.g. the motors working in cryogenic conditions. A time‐stepping FE method and transients analysis of an induction motor has been applied. The nonlinearity of the magnetic circuit, the movement of the rotor and the skewed slots have been taken into account. The results of computations have been compared with measurements.
Findings
The method presented and the elaborated specialised software for FE analysis of electromagnetic and thermal transients are used to determine the dynamic performance of the squirrel‐cage induction motor. The results of simulations compared with measurements confirm the adequacy of this approach to the analysis of coupled electromagnetic‐thermal problems.
Research limitations/implications
3D effects have only been taken into account by quasi‐3D techniques (e.g. the multi‐slice for the skewed rotor slots).
Practical implications
The software developed can be useful in the analysis and design of squirrel cage motor, especially motors working in cryogenic conditions.
Originality/value
The paper offers appropriate software for transient analysis of coupled electromagnetic and thermal problems in squirrel cage motors with skewed slots.
Keywords
Citation
Baranski, M., Demenko, A., Lyskawinski, W. and Szelag, W. (2011), "Finite element analysis of transient electromagnetic‐thermal phenomena in a squirrel cage motor", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 30 No. 3, pp. 832-840. https://doi.org/10.1108/03321641111110807
Publisher
:Emerald Group Publishing Limited
Copyright © 2011, Emerald Group Publishing Limited