To read this content please select one of the options below:

Transport properties and current flow patterns in homogeneous strongly anisotropic materials

Richard D. Chippendale (School of Electronics and Computer Science, University of Southampton, Southampton, UK)
Igor O. Golosnoy (School of Electronics and Computer Science, University of Southampton, Southampton, UK)
Paul L. Lewin (School of Electronics and Computer Science, University of Southampton, Southampton, UK)
Jan K. Sykulski (School of Electronics and Computer Science, University of Southampton, Southampton, UK)

Abstract

Purpose

The purpose of this paper is to investigate and explain the unexpected current flow patterns and twisting equipotential surfaces observed in strongly anisotropic materials.

Design/methodology/approach

Potential distributions and current flow paths in highly anisotropic composite materials were studied via numerical simulation and experimentally. Simplified composite panels with two plyes were analysed using a finite‐element model; the predictions were then confirmed experimentally.

Findings

The unexpected twisting equipotential surfaces and current flow patterns were found to be consistent with minimising of Joule heat release in the material. Numerical modelling suggests that the twisted profiles of the potential are highly sensitive to the anisotropic electrical conductivity.

Originality/value

This paper discusses the reverse current flows witnessed in a two‐layer anisotropic system. Such behaviour has never been predicted or observed experimentally before. The reported results will be of interest to anyone who is considering using anisotropic materials such as carbon fibre composites which might experience applied potential difference, such as lightning strikes.

Keywords

Citation

Chippendale, R.D., Golosnoy, I.O., Lewin, P.L. and Sykulski, J.K. (2011), "Transport properties and current flow patterns in homogeneous strongly anisotropic materials", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 30 No. 3, pp. 1047-1055. https://doi.org/10.1108/03321641111110988

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited

Related articles