TMA, DMA, DSC and TGA of lead free solders

Abstract

Most of the electronics packaging materials, especially solders, are temperature dependent. Their temperature‐dependent material properties can be obtained by TMA (thermal mechanical analysis), DMA (dynamic mechanical analysis), DSC (differential scanning calorimetry), and TGA (thermogravimetric analysis). In this study, the thermal coefficient of expansion (TCE), storage modulus, moisture uptake, and melting point of two lead free solders, 96.5wt%Sn‐3.5wt%Ag and 42wt%Sn‐58wt%Bi provided from two different vendors, are measured by, respectively, TMA, DMA, TGA, and DSC. For comparison purpose, the 63wt%Sn‐37wt%Pb solder is also considered.

Citation

Lau, J.H. and Chang, C. (1999), "TMA, DMA, DSC and TGA of lead free solders", Soldering & Surface Mount Technology, Vol. 11 No. 2, pp. 17-24. https://doi.org/10.1108/09540919910265640