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Performance of Cu‐ and Ag‐based microstrips up to millimetre wave frequencies

Esa Kemppinen (Nokia Telecommunications, Nokia Group, Finland)
Petri Mikkonen (Nokia Telecommunications, Nokia Group, Finland)
Paul E. Collander (Nokia Research Center, Finland)
Seppo Leppävuori (Oulu University, Microelectronics Laboratory, Linnanmaa, Finland)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 1998

257

Abstract

Attenuation characteristics of microstrip transmission lines on alumina substrates up to 50GHz are discussed. The lines under test came from three different manufacturers, each of whom used different processes to realise the transmission lines. Two of the manufacturers used silver (Ag) paste, whereas the process of one of the manufacturers was copper (Cu) based. Each manufacturer used identical alumina substrates and identical test pattern files so that the measured attenuation properties reflected manufacturer’s capability to fabricate microstrips and the quality of the metal system used. Measurements showed that the attenuation of copper microstrips was slightly lower than that of the silver microstrips, but the difference was small. Measured attenuation (S21) of about 50Ω microstrips was approximately 0.5db/cm at 30GHz and 0.8dB/cm at 50GHz, respectively. The loss coefficient, αt, of about 0.035dB/mm at 40GHz was obtained for the Cu microstrips. Such an attenuation is reasonable for many practical applications in the microwave and millimetre wave regions.

Keywords

Citation

Kemppinen, E., Mikkonen, P., Collander, P.E. and Leppävuori, S. (1998), "Performance of Cu‐ and Ag‐based microstrips up to millimetre wave frequencies", Microelectronics International, Vol. 15 No. 2, pp. 11-15. https://doi.org/10.1108/13565369810370319

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MCB UP Ltd

Copyright © 1998, MCB UP Limited

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