Service in e‐design: A web “top‐down” design tool for creating silicon micro‐components
Journal of Manufacturing Technology Management
ISSN: 1741-038X
Article publication date: 2 January 2007
Abstract
Purpose
The purpose of this research is to develop a kind of new service‐driven MEMS “top‐down” design method and implement the correspondent web‐based software prototype as verification.
Design/methodology/approach
Bond graphs are used as the output of conceptual design. Feature modeling technology is just a bridge to perform the feature mapping from the conceptual model to the structure and geometric model of micro‐components. To support design evaluations, a 3D whiteboard collaborative mechanism powered with networked VR service functions is put forward to visualize and operate small micro‐components in a macro world. In addition, service‐driven MEMS “top‐down” design flow is modeled as a formalized “AND/OR” graph with which the design service scheduling is finished with the priority‐in‐depth searching algorithm.
Findings
Traditional MEMS CAD systems were developed on the basis of “bottom‐up” design method mainly used in laboratory practice. Different from the above, this research presents a solution, which can outline a new service‐driven MEMS CAD model and decrease designers' dependency to manufacturing knowledge.
Research limitations/implications
It is still necessary to study further how to create a much more efficient feature modeling mechanism to enable design evaluation for micro manufacturing.
Practical implications
The new design method and the correspondent software prototyping would potentially help industry to promote the development of new MEMS CAD systems.
Originality/value
The value is to identify a kind of new MEMS CAD implementation mode, which is suitable for general design uses on network.
Keywords
Citation
Jiang, P., Yan, X. and Liu, Y. (2007), "Service in e‐design: A web “top‐down” design tool for creating silicon micro‐components", Journal of Manufacturing Technology Management, Vol. 18 No. 1, pp. 90-105. https://doi.org/10.1108/17410380710717661
Publisher
:Emerald Group Publishing Limited
Copyright © 2007, Emerald Group Publishing Limited