Du Pont and IQLP to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications

Circuit World

ISSN: 0305-6120

Article publication date: 18 November 2013

511

Citation

(2013), "Du Pont and IQLP to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications", Circuit World, Vol. 39 No. 4. https://doi.org/10.1108/CW-08-2013-0027

Publisher

:

Emerald Group Publishing Limited


Du Pont and IQLP to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications

Article Type: Industry news From: Circuit World, Volume 39, Issue 4

Du Pont Circuit and Packaging Materials (Du Pont) and IQLP, LLC are to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications. The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.

Following the completion of successful development efforts, it is anticipated that the technology will be utilised in the development and commercialisation by Du Pont of products for use in the production of circuits for applications such as smart phones, telecom, internet infrastructure, high-speed computing and radar sensing devices.

Du Pont and IQLP anticipate that their ongoing LCP thin-film technology research and development program will ultimately lead to the development and commercialization of dielectric materials that can offer electrical properties up to and over 100 gigahertz (Ghz). IQLP’s material science – an advance over current technology – provides bespoke properties, such as dielectric constant (Dk) and dissipation factor (Df), a tight control over dielectric thickness, and is capable of being manufactured in a high-volume, roll-to-roll format.

Potential products that Du Pont may develop which incorporate LCP thin-film technology may include double-sided copper clad laminates, along with LCP bond ply materials for use in fabricating multilayer circuit boards. Successful development and commercialization of products that incorporate LCP thin-film technology would allow Du Pont to provide a wider range of products in the high-frequency laminate marketplace, and would complement its existing Du Pont™ Pyralux® flexible circuit materials and Du Pont™ Interra™ embedded passive materials for rigid circuit boards product lines.

For more information please visit: http://www.dupont.com

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