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Improve electromagnetic compatibility of electronic products with multivariate parametric design

Chien-Yi Huang (Department of Industrial Engineering and Management, National Taipei University of Technology, Taipei, Taiwan)
Ching-Hsiang Chen (Department of Industrial Engineering and Management, National Taipei University of Technology, Taipei, Taiwan)

Microelectronics International

ISSN: 1356-5362

Article publication date: 3 January 2017

196

Abstract

Purpose

Differing from previous studies trying to solve the electromagnetic compatibility (EMC) issue by addressing single factor, this study aims to combine measures of shielding, filtering and grounding to design parameters with the Taguchi method at the beginning of product design to come up with the optimal parameter combination.

Design/methodology/approach

EMC-related performance such as radiated emission, conduction interference and electrical fast transient/burst immunity (EFT) are response variables, whereas the printed circuit board and mechanic design-relevant parameters are considered as control factors. The noise factors are peripherals used together with the tablet.

Findings

The optimal design parameter matrix based on results from the application and integration of multivariate analysis method of principal component grey relation and technique for order preference by similarity to ideal solution suggests 14 grounding screw holes, cooling aperture of casing at diameter of 3 mm and staggered layout and 300O filter located at source of noise. Validation of this matrix shows around 10, 1 and 8 per cent improvement in radiation, conduction interference and EFT immunity.

Originality/value

The multivariate quality parameters’ design method proposed by this study improves EMC characteristics of products and meets the design specification required by customer, accelerating electronic product research and development process and complying with electromagnetic interference test regulations set forth by individual country.

Keywords

Citation

Huang, C.-Y. and Chen, C.-H. (2017), "Improve electromagnetic compatibility of electronic products with multivariate parametric design", Microelectronics International, Vol. 34 No. 1, pp. 45-55. https://doi.org/10.1108/MI-11-2015-0088

Publisher

:

Emerald Group Publishing Limited

Copyright © 2017, Emerald Publishing Limited

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