A study on the effect of electromigration on solder alloy joint on copper with nickel surface finish
Soldering & Surface Mount Technology
ISSN: 0954-0911
Article publication date: 4 January 2018
Issue publication date: 23 January 2018
Abstract
Purpose
The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy joint on copper with nickel surface finish. Sn-Bi solder alloy has been used in this research.
Design/methodology/approach
The EM process was completed with the duration of 0, 24, 48, 72 and 96 h under direct current (DC) of 1,000 mA. Tensile stress on the substrates was assessed after EM at a tension rate of 0.1 mm/min. Microscopy was used to observe the formation and size of voids and conduct an analysis between copper and nickel substrates.
Findings
Four types of intermetallic compounds (IMCs), namely, Cu-Sn, Cu3Sn, Cu6Sn5, and Sn-Bi, were detected between the Sn-Bi/Co solder joint. Voids appear to be at the anode and the cathode for 96 h of EM for Sn-Bi/Ni solder join; however, there seem to be more voids at the cathode.
Originality/value
EM is one of the crucial keys to produce a good integrated circuit (IC). When the current density is extremely high and will cause the metal ions to move into the electron direction flow, it will be characterised based on the ion flux density. In this research, the effect of EM on the Sn-Bi solder alloy joint on copper with nickel surface finish was studied.
Keywords
Acknowledgements
The authors are thankful to Ministry Of Higher Education (MOHE) (Malaysia) for providing financial support to carry out this research study.
Citation
Mhd Noor, E.E., R., B. and J., E. (2020), "A study on the effect of electromigration on solder alloy joint on copper with nickel surface finish", Soldering & Surface Mount Technology, Vol. 30 No. 1, pp. 26-34. https://doi.org/10.1108/SSMT-06-2017-0016
Publisher
:Emerald Publishing Limited
Copyright © 2018, Emerald Publishing Limited