New laser drilling equipment for microvias

Citation

(1999), "New laser drilling equipment for microvias", Circuit World, Vol. 25 No. 1. https://doi.org/10.1108/cw.1999.21725aad.002

New laser drilling equipment for microvias

New laser drilling equipment for microvias

Keywords Excellon, Laser drilling, Microvias

Excellon Automation have introduced a new line of laser drilling equipment at the EPC show in Wiesbaden, Germany, which was held 28-30 September 1998. The new machines are the result of a strategic alliance with Exitech Ltd, UK.

Dick Pinto, Excellon president, said: "The new equipment is a hybrid laser designed specifically for drilling blind vias and microvias on multilayer PCBs and high density MCM-Ls at rates far surpassing any competitive products on the market today."

The agreement with Exitech gives Excellon the exclusive rights to manufacture, market, and distribute all Exitech and Excellon/Exitech co-developed laser via drilling and routeing machines for the interconnection market.

The Excellon LVD-2001 machine, demonstrated in Wiesbaden, will handle both rapid prototyping and full commercial production. The dual-pulsed CO₂ and YAG laser sources will drill, de-smear, route, and skive both copper and dielectrics. Blind via drilling can be done on FR4 at 18,000 holes/minute, while drilling rates on copper/FR4 combinations can exceed 2,000 holes/minute.

Excellon anticipates accepting orders for the manual systems for shipment in early 1999.