Citation
(2002), "Atotech B1.105", Circuit World, Vol. 28 No. 1. https://doi.org/10.1108/cw.2002.21728aad.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
Atotech B1.105
Atotech B1.105
Atotech will be exhibiting Seleo CP – a next generation direct plating process based on a conductive polymer (see Plate 1).
Plate 1 UniplateSeleoCP
The Seleo CP layer shows unsurpassed conductivity for highest throwing power demands for high aspect ratio HDI production. The acidic adhesion promoter creates a fine, uniform manganese dioxide layer. This prevents the excessive formation of manganese dioxide, which may cause a reduction of conductivity in reducing post-polymerization steps. Furthermore, perfect hole wall adhesion of the Cu plated is obtained. In the polymerisation step the Seleo CP Polyconduct acid and the new monomer ensure excellent conductivity.