Keywords
Citation
(2005), "Enthone introduces ENTEK® PLUS HT", Circuit World, Vol. 31 No. 4. https://doi.org/10.1108/cw.2005.21731dab.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited
Enthone introduces ENTEK® PLUS HT
Enthone introduces ENTEK® PLUS HT
Keywords: Soldering
Organic solderability process for lead-free soldering
Enthone Inc. has introduced ENTEK® PLUS HT organic solderability preservative (OSP) process. Specially designed to exceed the requirements of today's most demanding PCB lead-free assembly processes, ENTEK PLUS HT has been proven to maintain exceptional solderability through nine lead-free reflows.
The ENTEK PLUS HT process delivers the highest reliability BGA solder joint strengths. Based on patented ENTEK PLUS technology, the next generation ENTEK PLUS CU-106A (X) HT OSP provides a robust, lowest cost lead-free finish with superior thermal stability.
ENTEK PLUS HT meets the challenges of lead-free assembly while maintaining eutectic process capability. The process is capable of mixed metal processing, such as electroless nickel immersion gold (ENIG). Metal masking/taping requirements are eliminated, thus reducing defects and costs. The OSP selectively deposit on copper while leaving gold connectors or metallic heat sinks free of contamination.
As part of the four-step ENTEK PLUS HT process, ENTEK Cleaner SC- 1010DE removes trace contaminates and adequately wets small pad features. ENTEK Microetch ME-1020 further enhances the surface topography and thoroughly rinses the etched copper. Next, the patented ENTEK Precoat PC-1030 prepares the surface for a more stable, reliable coating. Finally, the ENTEK PLUS CU-106A (X) HT OSP operates at a low pH to ensure a consistent, highly stable final finish. The ENTEK PLUS HT process is compatible with existing equipment.
An ENTEK PLUS HT fact sheet provides an overview of the process and is available by enthone@cooksonelectronics.com.