Handbook of Thick Film Technology – 2nd edition

Citation

Goosey, M. (2006), "Handbook of Thick Film Technology – 2nd edition", Circuit World, Vol. 32 No. 2. https://doi.org/10.1108/cw.2006.21732bae.001

Handbook of Thick Film Technology – 2nd edition

Keith PittElectrochemical Publications LtdAsahi House, Church Road, Port Erin, Isle of Man, www.electrochem0 901150 42 8

The first edition of the Handbook of Thick Film Technology has been a standard reference for the electronics industry since its publication by Electrochemical Publications in 1976. The original edition was edited by P.J. Holmes and R.G. Loasby with individual chapters authored by a range of industry experts. This second edition, edited by Keith Pitt, follows as far as possible the structure and format of the first edition but with both updating and expansion of the text into areas and topics which have developed in significance more recently. Some of the original authors reappear, although there are a good quantity of contributions from new authors and the editor himself. This second edition is both longer at 506 pages than its predecessor (430 pages) and physically larger. As with all Electrochemical Publications books, this work is well produced and printed on high-quality paper.

The book has 16 chapters which effectively divide the subject matter into three areas. The first group of chapters deals with the historical development, the basic principles of the technology and the essential features of the production equipment. Next comes a group of chapters which discuss the composition and properties of each of the principal constituents of thick film circuits i.e. substrates, conductors, dielectrics and resistors. The later chapters then focus on aspects related to thick film applications. Thermal design, microwave properties and the trimming of resistors are described. A large proportion of thick film circuits are used as the basis of hybrid circuits and a major chapter is devoted to component attachment and circuit assembly. A companion chapter on packaging and a discussion of reliability questions concludes the review of current technology and the final contribution takes a forward look towards the future of thick films.

The actual subject matter of the book is as follows. The first three chapters cover the development of thick film technology, materials and processes and the printing of thick film hybrids, while the next three cover substrates, conductors and dielectrics. Chapters 7 and 8 discuss the theory and practice of resistors and resistor materials including their structure, composition and other characteristics. Chapter 9, outlining some design approaches, has been written by Keith Pitt and is new for this edition. Chapters 10 and 11, on microwave properties and thermal design, have been rewritten for the present day. Chapter 12, on adjustment of resistors, Chapter 13, on assembly technology, and Chapter 14, on packaging and encapsulation, are all new versions of the previous titles. Chapter 15, on reliability, has broadened in scope to examine process defects as well as other materials, manufacturing and statistical topics. Chapter 16 outlines some current developments and looks forward to possible future developments.

Keith Pitt has been in associated with the electronics industry for many years and is an acknowledged expert on thick films. The original version of this book, has become a “must read” for anyone venturing into the field of thick films and he is to be applauded for taking the time to bring this work up to date and for producing this second edition. For anyone working with thick film technology, or who is studying the subject, this book will provide a good source of information and it will continue to be the standard reference work. Consequently, I have no hesitation in recommending it.

Martin GooseySeptember 2005