Etching Parameters: Their Individual and Collective Impact on High Density Circuit Production

Abstract

High density PCB production requires ever closer investigation of the factors which influence the ability to fabricate efficient circuitry. One of these, etching, is examined, revealing that even that process alone is subject to the effect of physical, chemical and hydraulic parameters. Physical factors include raw materials, circuit geometry and process equipment, etcher spray systems being discussed at length. The implications of the chemical parameters are specifically linked with etchant formulation. Oxidation reduction potential and etchant density effects are also dealt with before the final section on hydraulic factors, where the importance of the design of the hydraulics system is underlined.

Citation

Swartzell, J.C. (1981), "Etching Parameters: Their Individual and Collective Impact on High Density Circuit Production", Circuit World, Vol. 8 No. 1, pp. 21-23. https://doi.org/10.1108/eb043659