Tape Automated Bonding and its Impact on the PWB
D.J. Small
(British Telecom Research Laboratories, Ipswich, Suffolk, England)
29
Abstract
This paper briefly reviews the impact that tape automated bonding systems are having in the semiconductor industry and describes a recent development of a bumped testable TAB system suitable for direct assembly to PWBs. The impact that such a system will have on PWB technology is discussed.
Citation
Small, D.J. (1984), "Tape Automated Bonding and its Impact on the PWB", Circuit World, Vol. 10 No. 3, pp. 26-29. https://doi.org/10.1108/eb043725
Publisher
:MCB UP Ltd
Copyright © 1984, MCB UP Limited